Light Emitting Device Substrate Reinforcement
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Solution Overview
Problem
Existing methods for manufacturing light emitting devices face challenges in precisely joining reinforcing materials with substrates, leading to potential position displacement and warping issues.
Innovation Solution
A method involving substrate preparation, reinforcing member formation using resin materials, mounting light emitting elements, placing light-transmissive members, sealing with a reflective resin, and precise cutting to suppress warping, utilizing alignment marks and carefully controlled resin application to maintain substrate flatness and precision.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a plate-shaped reinforcing material with higher rigidity than the substrate is joined to the substrate, then substrate warping is suppressed, but position displacement between the reinforcing material and substrate occurs due to joining precision issues
Solution Approach 1:
Alignment marks are formed on the substrate before the reinforcing material is applied. The alignment marks serve as reference features that enable precise positioning of the reinforcing material relative to the substrate, preventing position displacement while maintaining substrate flatness.
Solution Approach 2:
A resin layer is used as an intermediary between the substrate and the reinforcing material. This resin layer provides a bonding interface that allows for precise alignment through the alignment marks while accommodating minor surface variations, thus resolving the positioning precision issue.
2Manufacturing precision
If a reinforcing member is formed by applying resin material on the second region and hardening it, then substrate warping is suppressed with high precision, but the process complexity increases
Solution Approach 1:
The alignment marks formation is integrated into the substrate preparation process, and the reinforcing material application is combined with the sealing process. These integrations reduce the number of separate manufacturing steps while maintaining high precision substrate flatness control.
Solution Approach 2:
The resin material serves multiple functions: it acts as the reinforcing member to suppress warping, serves as the sealing material to protect the light emitting elements, and provides the bonding interface for alignment. This multi-functionality reduces process complexity while maintaining manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively suppresses substrate warping and ensures high precision in manufacturing light emitting devices by using a reinforcing member to match the substrate's linear expansion coefficient, maintaining flatness and reducing variations in device size and light emission.
Implementation Method 1
forming a reinforcing member by applying a resin material on the second region and hardening the resin material
Data Source
AI summary
A method for manufacturing a light emitting device includes: a substrate preparation step for preparing a substrate having a first region on which a plurality of light emitting devices are formed, and a second region surrounding the first region; a reinforcing member forming step for forming a reinforcing member by applying a resin material on the second region and hardening the resin material; a mounting step for mounting a plurality of light emitting elements on the first region; a light-transmissive member placing step for forming a plurality of light-transmissive members respectively on the light emitting elements; a sealing member forming step for sealing the plurality of light emitting elements and the plurality of light-transmissive members using a sealing member; and a cutting step for cutting the substrate and the sealing member and separating into individual light emitting devices.