LED Substrate Riveting Mechanism for Strong Pin Bonding

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Solution Overview

Problem

The existing manufacturing method for LED substrates, which relies on conductive silver paste sintering, results in a poor bonding force between the carrier substrate and terminal pins, leading to a high risk of debonding during packaging and sealing processes, thereby increasing product reject ratios.

Innovation Solution

A manufacturing method that involves preparing a carrier substrate with riveting points, sintering conductive lines over these points, and riveting terminal pins using terminal foot claws and hollow-out holes to create a strong conductive connection, reducing the need for silver paste spot coating and high-temperature sintering.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If conductive silver paste sintering is used to connect terminal pins to carrier substrate, then the manufacturing process is simple, but the bonding force is poor and debonding risk is high

Engineering Contradiction:

Improvemanufacturing process simplicityVSAvoidbonding force between terminal pins and carrier substrate

Core Design Contradiction:

Ease of manufactureVSStrength

Solution Approach 1:

The connection structure is segmented into multiple components: hollow-out holes in the carrier substrate, terminal foot claws on terminal pins, and conductive lines. This segmentation allows each component to contribute to the overall bonding strength through mechanical interlocking and distributed stress, resolving the contradiction between simple manufacturing and strong bonding.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The terminal foot claws are inserted into the hollow-out holes of the carrier substrate, creating a nested structure. This nesting provides mechanical interlocking that significantly enhances bonding force while maintaining manufacturing simplicity through a straightforward insertion and riveting process.

Inventive Principle:

Principle #7Nested doll (Nesting)

2Reliability

If silver paste high temperature sintering is used, then terminal pins can be connected to carrier substrate, but the combining force is poor leading to high product reject ratio

Engineering Contradiction:

Improveconnection reliabilityVSAvoidmanufacturing complexity

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The chemical sintering process is replaced with a mechanical connection system consisting of hollow-out holes, terminal foot claws, and riveting. This mechanical substitution provides superior bonding force and reliability while simplifying the manufacturing process by eliminating high-temperature sintering requirements.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Productivity

If traditional silver paste coating and sintering process is used, then terminal pins are connected, but production efficiency is low and labor cost is high

Engineering Contradiction:

Improveproduction efficiencyVSAvoidmanufacturing process complexity

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The hollow-out holes are pre-formed in the carrier substrate before terminal pin attachment. This preliminary action enables subsequent rapid insertion and riveting of terminal foot claws, significantly improving production efficiency while the standardized hole patterns maintain manufacturing simplicity.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The terminal foot claws are designed to be self-aligning with the hollow-out holes through their geometric configuration. This self-service feature eliminates the need for complex alignment mechanisms or procedures, improving productivity while keeping the manufacturing process simple.

Inventive Principle:

Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enhances the bonding force between the terminal pins and the carrier substrate, reducing the risk of debonding and product rejects, while improving production efficiency and reducing labor costs by simplifying the process.

Implementation Method 1

sintering conductive lines on the carrier substrate

Methodology Applied

Scientific EffectSintering: Sintering

Data Source

PatentUS11309472B2Manufacturing method for LED substrate and LED substrate

Publication Date: 2022.04.19 SHENZHEN SANGSHEN E COMMERCE CO LTD

AI summary

The present disclosure provides a manufacturing method for an LED substrate and the LED substrate, the manufacturing method for the LED substrate includes following steps: S1: preparing a carrier substrate, disposing riveting points on preset positions of the carrier substrate; S2: sintering conductive lines on the carrier substrate, and covering an outer periphery of each riveting point with connecting ends of the conductive lines; and S3: riveting terminal pins to the riveting points, combining the terminal pins with the carrier substrate, and forming a conductive connection between the terminal pins and the connecting ends of the conductive lines. Compared with a traditional manufacturing method of the LED substrate, in a manufacturing process, steps of silver paste spot coating, silver paste high-temperature sintering and the like are reduced.