LED Substrate Light Scattering Voids for Extraction Efficiency

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Solution Overview

Problem

Conventional GaN-based LEDs suffer from low light extraction efficiency due to total internal reflection and absorption by the substrate and metal contacts, which reduces the percentage of generated photons that escape the LED die.

Innovation Solution

Incorporating light scattering areas, such as voids or reflective particles, into the growth substrate or replacing the substrate with a new one containing light scattering features to redirect light away from absorbing areas and reduce guided light within the substrate, thereby enhancing light extraction efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If a transparent substrate is used to allow light extraction, then light can exit the LED die, but total internal reflection and light guiding in the substrate reduce light extraction efficiency

Engineering Contradiction:
Improvelight extraction efficiencyVSAvoidtotal internal reflection and light guiding
Core Design Contradiction:
Loss of energyVSObject-generated harmful factors

Solution Approach 1:

The substrate is designed with an array of through-holes or voids that extend through its thickness. These porous features disrupt the continuous transparent medium, preventing light guiding and total internal reflection while still allowing light extraction. The voids scatter light rays that would otherwise be trapped, improving light extraction efficiency without compromising the substrate's transparency function.

Inventive Principle:
Principle #31Porous materials

2Loss of energy

If light scattering areas are added to the substrate, then light extraction efficiency increases, but the substrate structure becomes more complex

Engineering Contradiction:
Improvelight extraction efficiencyVSAvoidsubstrate structure
Core Design Contradiction:
Loss of energyVSDevice complexity

Solution Approach 1:

The substrate is segmented into multiple regions by creating an array of discrete through-holes or voids. Each void acts as an independent light scattering element, and the collective array provides comprehensive light extraction enhancement. This segmentation approach achieves the desired optical function while maintaining a relatively simple manufacturing process using standard photolithography and etching techniques.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The implementation of light scattering areas effectively increases light extraction efficiency by minimizing absorption and guiding, allowing more photons to escape the LED die, leading to improved brightness and color uniformity.

Implementation Method 1

the transparent growth substrate of an LED die is formed to have light scattering areas, such as voids formed using a laser or other method

Methodology Applied
Scientific EffectLight scattering: Scattering

Implementation Method 2

the substrate may be formed to include reflective particles, such as TiO2 particles or reflective metal flakes, in selected areas

Methodology Applied
Scientific EffectReflection: Reflection

Implementation Method 3

One contribution to light absorption is total internal reflection (TIR) by the substrate 18, shown by the light ray 24 being trapped inside the substrate 18, where the substrate 18 acts as a light guide

Methodology Applied
Scientific EffectTotal internal reflection: Total Internal Reflection

Data Source

PatentUS10074786B2LED with scattering features in substrate
Publication Date: 2018.09.11 LUMILEDS SINGAPORE PTE LTD
  • US10074786B2 patent drawing
  • US10074786B2 patent drawing
  • US10074786B2 patent drawing

AI summary

In one embodiment, the transparent growth substrate of an LED die is formed to have light scattering areas, such as voids formed by a laser. In another embodiment, the growth substrate is removed and replaced by another substrate that is formed with light scattering areas. In one embodiment, the light scattering areas are formed over the light absorbing areas of the LED die, to reduce the amount of incident light on those absorbing areas, and over the sides of the substrate to reduce light guiding. The replacement substrate may be formed to include reflective particles in selected areas. A 3D structure may be formed by stacking substrate layers containing the reflective areas. The substrate may be a transparent substrate or a phosphor tile that is affixed to the top of the LED.