LED Substrate Packaging with Top-Side Landing Pads
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Solution Overview
Problem
Conventional LED packaging technologies are inefficient and costly, with high material waste and non-uniformity issues due to the use of expensive phosphor and silicone materials, and they require non-standard semiconductor packaging equipment, making it difficult to shrink LED package sizes and handle them using standard equipment.
Innovation Solution
The method involves forming lenses over LED dies on a substrate with top-side contacts using compression molding, selectively removing material to expose the contacts, and using micro-bead blasting or high-pressure water to remove silicone flash layers, allowing for the use of standard semiconductor packaging technologies and enabling smaller package sizes and more efficient interconnects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional LED packaging technologies are used, then LED chips can be packaged and protected, but material waste increases and manufacturing costs rise due to expensive phosphor and silicone materials
Solution Approach 1:
The patent changes the material parameters by replacing expensive phosphor and silicone with more cost-effective alternatives. Specifically, it uses conventional packaging materials that are less expensive and generate less waste while still providing the necessary protection and functionality for LED chips.
Solution Approach 2:
The patent employs cheaper packaging materials that can be easily disposed of or replaced without significant cost impact. This approach uses standard, inexpensive materials rather than expensive phosphor and silicone, reducing both material cost and waste value concern.
2Reliability
If conventional LED packaging is used, then LED chips are protected, but manufacturing costs increase due to expensive materials and non-standard equipment requirements
Solution Approach 1:
The patent makes the packaging process universal by using standard semiconductor packaging equipment that can handle multiple types of devices. This eliminates the need for specialized equipment, reducing manufacturing costs while maintaining protection quality through proven standard processes.
Solution Approach 2:
The patent uses inexpensive, readily available packaging materials instead of expensive phosphor and silicone, significantly reducing material costs while still providing adequate protection through standard packaging approaches.
3Reliability
If conventional LED packaging technologies are used, then LED chips can be packaged, but package sizes cannot be shrunk due to non-standard equipment requirements
Solution Approach 1:
The patent enables package size reduction by using standard semiconductor packaging equipment that is designed for precise, small-scale handling. This universal equipment approach allows scaling to smaller sizes without requiring specialized large-scale equipment.
Solution Approach 2:
The patent changes the scale parameters by adapting standard packaging processes to smaller dimensions. Using conventional equipment allows precise control over smaller package sizes while maintaining the protective function through proven packaging methodologies.
4Reliability
If conventional LED packaging is used, then LED chips are protected, but handling becomes difficult due to non-standard equipment requirements
Solution Approach 1:
The patent improves handling ease by using standard semiconductor packaging equipment that operators are already familiar with. This universal equipment approach simplifies training, operation, and maintenance while maintaining effective chip protection through established handling procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing costs, minimizes waste, and facilitates the use of standard equipment for LED packaging, enabling smaller sizes and more efficient electrical connections, thereby improving the cost-effectiveness and quality of LED devices.
Implementation Method 1
forming lenses over LED dies on a substrate with top-side contacts using compression molding
Implementation Method 2
using micro-bead blasting or high-pressure water to remove silicone flash layers
Implementation Method 3
using micro-bead blasting or high-pressure water to remove silicone flash layers
Data Source
AI summary
Standardized photon building blocks are packaged in molded interconnect structures to form a variety of LED array products. No electrical conductors pass between the top and bottom surfaces of the substrate upon which LED dies are mounted. Microdots of highly reflective material are jetted onto the top surface. Landing pads on the top surface of the substrate are attached to contact pads disposed on the underside of a lip of the interconnect structure. In a solder reflow process, the photon building blocks self-align within the interconnect structure. Conductors in the interconnect structure are electrically coupled to the LED dies in the photon building blocks through the contact pads and landing pads. Compression molding is used to form lenses over the LED dies and leaves a flash layer of silicone covering the landing pads. The flash layer laterally above the landing pads is removed by blasting particles at the flash layer.