LED Substrate With Trench Channels For Uniform Heat Dissipation
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Solution Overview
Problem
High power LEDs generate significant heat, leading to overheating and reduced service life, especially in multi-chip package structures where central chips experience poorer heat dissipation compared to peripheral chips, affecting the reliability of the entire package.
Innovation Solution
A substrate structure with a patterned metal layer and heat dissipating channels disposed in trenches between device bonding areas, facilitating heat conduction to the metal layer and convection to the external environment, ensuring efficient heat dissipation for both central and peripheral LED chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If high power LED chips are used to increase brightness, then illumination intensity is improved, but heat generation increases causing temperature to rise
Solution Approach 1:
The patent extracts heat away from the LED chips by introducing dedicated heat dissipating channels that penetrate through the substrate. These channels create pathways for heat to be removed from the central area where LEDs are mounted, separating the heat generation source from the accumulation zone and enabling active heat extraction to maintain lower operating temperatures.
Solution Approach 2:
The substrate structure acts as an intermediary between the heat-generating LED chips and the external environment. By incorporating heat dissipating channels and conducting material layers within the substrate, it mediates heat transfer from the LEDs through conduction and convection pathways, facilitating efficient heat removal while maintaining the structural integrity and electrical functionality required for LED operation.
2Illumination intensity
If LED chips are arranged in a multi-chip array to increase light output, then illumination intensity is improved, but heat dissipation efficiency deteriorates in the central area
Solution Approach 1:
The patent segments the substrate into distinct functional zones: LED mounting areas with enhanced heat dissipation and central areas with dedicated heat dissipating channels. This segmentation allows different regions to perform specialized functions - the LED areas generate light while the central channels actively remove heat, preventing heat accumulation in the multi-chip array and ensuring uniform temperature distribution across all LEDs.
Solution Approach 2:
The patent addresses heat dissipation by adding a vertical dimension with heat dissipating channels that penetrate through the substrate thickness. Rather than relying solely on horizontal heat spreading, the channels create three-dimensional heat removal pathways that efficiently extract heat from the central area of multi-chip arrays, enabling better thermal management for high-density LED configurations.
3Temperature
If heat dissipating channels are added to improve heat dissipation, then temperature control is improved, but device complexity increases
Solution Approach 1:
The substrate is designed as a multi-functional component that simultaneously provides mechanical support for LED mounting, electrical connectivity through integrated circuits and conductors, and active heat dissipation through penetrating channels. By combining these functions into a single substrate structure rather than separate components, the design achieves effective thermal management without proportionally increasing overall device complexity.
Solution Approach 2:
The patent merges the heat dissipation function with the existing substrate structure by integrating heat dissipating channels directly into the substrate material. Rather than adding separate cooling components, the channels are incorporated during substrate fabrication, combining thermal management with structural support and electrical routing functions to minimize additional complexity while achieving effective heat removal.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The substrate structure effectively dissipates heat generated by LED chips, enhancing the reliability and service life of both central and peripheral chips by maintaining similar heat dissipation efficiency across the board, thereby improving the overall performance of the multi-chip package.
Implementation Method 1
the heat generated by the heat generating elements is conducted to the lower patterned metal layer through heat conduction
Implementation Method 2
can have a convection to the external environment by the patterned metal layer
Data Source
AI summary
A substrate structure for carrying plural heat generating elements is provided. The substrate structure includes a board, a patterned metal layer and plural heat dissipating channels. The board has an upper surface. The patterned metal layer is disposed on the board and includes a first electrode, a second electrode, plural first pads and plural second pads. The first pads and the second pads are alternatively disposed on the upper surface in parallel. Parts of the first (second) pads are electrically connected to the first (second) electrode. The other parts of first pads and the other parts of second pads are electrically connected to each other. Each first pad and the adjacent second pad define a device bonding area. The heat generating elements are respectively disposed in the device bonding areas. There are multiple trenches between the two adjacent device bonding areas. The heat dissipating channels are disposed in the trenches.