LED Support Electrode Layout for Heat Dissipation and Short-Circuit Control
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Solution Overview
Problem
Ultraviolet LED devices face reduced heat dissipation performance due to the need for spacing between heat dissipation pads and electrode pads to prevent solder short circuits, which compromises the area and effectiveness of the heat dissipation pad.
Innovation Solution
An LED support design featuring a substrate with a conductive through hole, an inner electrode, a heat dissipation pad, and an electrode pad with a solder resist layer, where the electrode pad includes a top connection layer and a bottom electrode layer, and the solder resist layer is filled between the electrode pad and heat dissipation pad to minimize spacing and prevent short circuits while maximizing heat dissipation area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the spacing between the heat dissipation pad and the electrode pad is increased to prevent solder short circuits, then the reliability of soldering is improved, but the area of the heat dissipation pad is reduced
Solution Approach 1:
The electrode pad is segmented into a top connection layer and a bottom electrode layer, with the connection portion extending downward to connect to the conductive through hole. This segmentation allows the bottom electrode layer to provide a longer surface spacing for soldering reliability while the top connection layer maintains electrical connection, effectively resolving the contradiction between soldering reliability and heat dissipation pad area.
Solution Approach 2:
The solder resist layer is introduced as an intermediary substance filled in the groove between the electrode pad and heat dissipation pad. It covers the connection portion and prevents solder from moving inwardly, allowing the spacing between the heat dissipation pad and the connection portion to be reduced while maintaining soldering reliability, thus preserving heat dissipation pad area.
2Reliability
If the position of the conductive through hole is arranged inwardly to separate the inner electrode from the metal box dam, then the electrical insulation is improved, but the area of the heat dissipation pad is reduced
Solution Approach 1:
The electrode pad structure extends in the vertical dimension with the connection portion extending downward between the top connection layer and bottom electrode layer. This dimensional extension allows the conductive through hole to be positioned inwardly for electrical insulation while the extended connection portion maintains electrical connectivity without reducing the heat dissipation pad area on the surface.
3Manufacturing precision
If the spacing between the heat dissipation pad and electrode pad is increased to prevent solder movement, then the manufacturing precision is improved, but the heat dissipation performance is reduced
Solution Approach 1:
The solder resist layer acts as a mediator that fills the groove and covers the connection portion, providing a physical barrier that prevents solder from moving inwardly. This allows the spacing between the heat dissipation pad and connection portion to be minimized for optimal heat dissipation while the solder resist layer ensures solder placement precision by containing the solder within the electrode pad area.
Data Source
AI summary
Provided is an LED support. The LED support includes a substrate, an inner electrode, a heat dissipation pad, an electrode pad, and a solder resist layer. The electrode pad includes a top connection layer and a bottom electrode layer that are laminated. The top connection layer is connected to the back of the substrate and is provided with a connection portion extending toward the heat dissipation pad and connected to the conductive through hole in the substrate. The connection portion is between the heat dissipation pad and the bottom electrode layer. The spacing between the bottom electrode layer and the heat dissipation pad is greater than the spacing between the connection portion and the heat dissipation pad. The solder resist layer is filled in a groove formed between the electrode pad and the heat dissipation pad on the back of the substrate, and covers the connection portion.