Pre-molded LED Support Mount with Integrated Lead Frame
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Solution Overview
Problem
The conventional method of producing LED light modules is complex and prone to damage due to high temperatures in the reflow soldering process, requiring multiple LED units and a printed circuit board for electrical connection.
Innovation Solution
A pre-molded support mount with an insulative substrate and a lead frame that allows direct electrical connection and mechanical support of LED chips, eliminating the need for a printed circuit board and reflow soldering by using exposed positive and negative electrical contacts for power supply, enabling series and parallel connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional LED light module production uses reflow soldering process to electrically connect LED units to PCB, then reliable electrical connection is achieved, but LED chips are damaged due to high temperature
Solution Approach 1:
The patent merges the LED chip mounting and electrical connection functions into a single integrated support mount structure. The lead frame serves both as mechanical support and electrical connection medium, eliminating the need for separate PCB and soldering process, thus avoiding high temperature damage while maintaining reliable electrical connection.
Solution Approach 2:
The patent extracts the electrical connection function from the PCB and reflow soldering process, transferring it directly to the lead frame. By taking out the harmful high temperature soldering step and using the lead frame's inherent conductivity, the patent achieves electrical connection without thermal damage to LED chips.
2Illumination intensity
If conventional LED light module production uses multiple LED units with PCB and reflow soldering, then sufficient luminance is achieved, but manufacturing process becomes complicated
Solution Approach 1:
The patent combines multiple LED chip mounting, electrical connection, and structural support functions into a single integrated support mount. This merging eliminates the need for separate PCB and multiple assembly steps, simplifying the manufacturing process while maintaining the capability to achieve sufficient luminance through multiple LED chips arranged on the lead frame.
Solution Approach 2:
The lead frame in the patent serves multiple functions simultaneously: mechanical support for LED chips, electrical connection medium, and structural component of the light module. This multi-functionality eliminates the need for separate PCB and simplifies the overall device structure while maintaining sufficient luminance output.
3Reliability
If conventional LED light module production uses packaged LED units with leads, then mechanical support and electrical connection are achieved, but production time increases due to multiple steps
Solution Approach 1:
The patent applies preliminary action by pre-embedding the lead frame structure with electrical contacts and mounting positions before LED chip mounting. This pre-prepared integrated structure eliminates the need for subsequent PCB assembly and soldering steps, reducing production time while maintaining reliable mechanical support and electrical connection.
Solution Approach 2:
The patent merges the mechanical support and electrical connection functions into a single integrated support mount structure, eliminating the need for separate PCB assembly and soldering steps. This consolidation of functions into one component significantly reduces the number of manufacturing steps and overall production time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution simplifies the manufacturing process, reduces the risk of LED chip damage, and lowers production costs by eliminating the need for reflow soldering and printed circuit boards, while allowing stable voltage and current supply to the LED chips.
Implementation Method 1
a lead frame for mechanically supporting and electrically connecting a plurality of LED chips
Implementation Method 2
electrically connecting a plurality of LED chips... exposed positive and negative electrical contacts through which the power can be supplied to the LED chips
Implementation Method 3
electrically and respectively connected with the positive and negative pole plates through bonding wires
Data Source
AI summary
A pre-molded support mount of lead frame-type for an LED light module includes an insulative substrate and a lead frame embodied inside the insulative substrate and provided with a positive electrical contact and a negative electrical contact, which are exposed out of the insulative substrate. A plurality of LED chips can be mounted on the pre-molded support mount and electrically connected in series or in parallel through the lead frame. The pre-molded support mount has the advantage of being capable of simplifying manufacturing process and saving manufacturing costs in production of the LED light module.