LED Package Supporting Layer for Thickness and Strength
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Solution Overview
Problem
Conventional light emitting diode packages are vulnerable due to their thickness, which needs to be reduced for improved performance, but this makes them more fragile.
Innovation Solution
A light emitting diode package design comprising a light emitting diode chip, a light conversion layer, a reflecting layer, and a supporting layer, where the supporting layer enhances mechanical strength and heat dissipation, and the method involves forming a supporting layer with through holes for improved connection and adaptation, using materials like copper, nickel, or silver, and incorporating light conversion layers made of fluorescent powders or quantum dots.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the light emitting diode package is made thinner, then the performance is improved, but the mechanical strength decreases and the package becomes more vulnerable
Solution Approach 1:
The patent implements a multi-layer nested structure where the light emitting diode chip is embedded within the supporting layer, which is then enclosed by the adhesive layer and sealing structure. This nested arrangement allows the package to maintain a thin overall profile while each nested layer contributes to mechanical strength, resolving the contradiction between thinness and vulnerability.
Solution Approach 2:
The patent employs composite material construction by combining the light emitting diode chip with the supporting layer made of complementary materials. This composite structure integrates the optical functionality of the LED chip with the mechanical support properties of the supporting layer, enabling the package to be thin yet mechanically robust.
2Strength
If the supporting layer is made thicker to enhance mechanical strength, then the vulnerability is reduced, but the overall package thickness increases
Solution Approach 1:
The patent applies local quality by concentrating the mechanical support function specifically in the supporting layer that directly contacts and supports the light emitting diode chip. This localized reinforcement provides necessary mechanical strength at the critical stress points without requiring the entire package to be thicker, thus maintaining overall thinness while achieving local structural integrity.
3Ease of manufacture
If conventional structures are used, then manufacturing is simpler, but heat dissipation is insufficient
Solution Approach 1:
The patent introduces the supporting layer as an intermediary component between the light emitting diode chip and the external environment. This supporting layer serves as a thermal mediator that facilitates heat transfer from the chip while maintaining the structural integrity and electrical isolation, thus improving heat dissipation without complicating the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a balance between reduced thickness and enhanced mechanical strength, allowing for efficient heat dissipation and improved light conversion, resulting in a more robust and efficient light emitting diode package.
Implementation Method 1
Light emitting diode package is a semiconductor device for converting current to light
Implementation Method 2
incorporating light conversion layers made of fluorescent powders or quantum dots
Implementation Method 3
the supporting layer enhances mechanical strength and heat dissipation
Data Source
AI summary
A light emitting diode package includes a light emitting diode chip, a light conversion layer covering the light emitting diode chip, a reflecting layer surrounding the light emitting diode chip. The light emitting chip has a light output top surface, a first electrode and a second electrode. The first electrode and the second electrode are opposite to the light output top surface. The light emitting diode package further includes a supporting layer made of metal material. The supporting layer is mounted on a bottom surface of the reflecting layer facing away from the light output top surface and surrounds the light emitting chip and the light conversion layer.