LED Supporting Layer Absorbs Vibration During Substrate Removal
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Solution Overview
Problem
The separation process of epitaxial layers from growth substrates in LED manufacturing often results in cracking due to the generation of vibration waves during substrate removal, which can damage the layers and hinder efficient transfer to receiving substrates.
Innovation Solution
A method involving the formation of a supporting layer with a higher Young's modulus than the adhesive layer, which absorbs vibration waves and prevents cracking, allowing for the removal of the growth substrate using laser lift-off or combined laser and chemical lift-off techniques, followed by transfer of micro-LED structures to a receiving substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the growth substrate is removed using laser lift-off or chemical lift-off, then the epitaxial layers can be transferred to receiving substrates, but vibration waves are generated causing cracking of the epitaxial layers
Solution Approach 1:
A supporting layer is formed on the LED structure before substrate removal to cushion and absorb the vibration waves generated during laser lift-off or chemical lift-off. This supporting layer acts as a protective buffer that prevents the vibration waves from directly impacting and cracking the epitaxial layers, thereby maintaining their structural integrity while enabling effective substrate removal.
Solution Approach 2:
The supporting layer serves as an intermediary between the growth substrate and the epitaxial layers during the substrate removal process. It mediates the interaction by absorbing the harmful vibration waves generated during laser lift-off or chemical lift-off, allowing the substrate to be removed without directly transmitting damaging forces to the fragile epitaxial layers.
2Reliability
If the supporting layer has a higher Young's modulus than the adhesive layer, then vibration waves are effectively absorbed, but the supporting layer requires precise material selection and fabrication
Solution Approach 1:
The invention specifies that the supporting layer should have a Young's modulus greater than that of the adhesive layer. This parameter change ensures that the supporting layer is sufficiently rigid to absorb and dampen vibration waves effectively. By controlling this specific material property parameter, the design achieves optimal vibration absorption while maintaining manufacturability through standard material selection and fabrication processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively prevents cracking of epitaxial layers during substrate removal and enables the transfer of high-density micro-LED arrays to receiving substrates, enhancing the manufacturing process by maintaining structural integrity and facilitating integration into heterogeneous systems.
Implementation Method 1
absorbing at least one vibration wave created by the removing through the supporting layer
Implementation Method 2
temporarily adhering the supporting layer to a carrier substrate through an adhesive layer
Implementation Method 3
the removing is performed by laser lift-off or a combination of the laser lift-off and chemical lift-off
Data Source
AI summary
A method for manufacturing at least one light emitting diode (LED) includes epitaxying at least one light emitting diode (LED) structure on a growth substrate; forming at least one supporting layer on the LED structure; temporarily adhering the supporting layer to a carrier substrate through an adhesive layer, in which the supporting layer has a Young's modulus greater than that of the adhesive layer; and removing the growth substrate from the LED structure.