Tapered Dicing Line Structure for LED Substrate Splitting
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Solution Overview
Problem
Conventional light-emitting device manufacturing processes result in irregular edges and non-uniform light distribution due to lattice shifts and cracks during the laser splitting process, which can lead to electrode damage and reduced production yield.
Innovation Solution
The method involves forming specific laser inscribed marks on the substrate's dicing lines, with varying laser power and focal points to control crack formation, ensuring the substrate is split along resistant and easily cracked planes to prevent damage to the semiconductor stacks and electrodes, thereby maintaining the integrity of the light-emitting devices and enhancing uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the dicing line width is increased to prevent cracks from extending to the electrode area, then the reliability of the light-emitting device is improved, but the production yield decreases due to restricted manufacturing efficiency
Solution Approach 1:
The patent changes the geometric parameters of the dicing line by introducing a tapered structure where the width varies along the length. The dicing line has a first width at the starting end and a second width at the ending end, with the ratio between them being 1:2 to 1:5. This parameter change allows the dicing line to provide sufficient crack prevention width near the electrode area while maintaining narrower width in other regions to preserve manufacturing efficiency and production yield.
2Ease of manufacture
If conventional laser splitting is used to split the light-emitting wafer, then the manufacturing process is simple, but lattice shifts and cracks occur causing irregular edges and non-uniform light distribution
Solution Approach 1:
The patent introduces specific geometric parameters to the dicing line structure, including a tapered width variation along the dicing line length with a width ratio of 1:2 to 1:5 between starting and ending ends. This parameter modification transforms the conventional uniform-width dicing line into a controlled-taper structure that guides crack propagation along a precise path, thereby achieving regular edges and uniform light distribution while maintaining manufacturing simplicity.
3Reliability
If the dicing line width is increased to prevent electrode damage, then the reliability is improved, but the device complexity increases due to modified dicing line structure
Solution Approach 1:
The patent segments the dicing line structure into distinct regions with different width characteristics. The dicing line is divided into a starting end region with narrower width and an ending end region with wider width, creating a tapered transition zone. This segmentation allows the structure to provide enhanced electrode protection where needed while maintaining simplicity in other areas, thereby balancing reliability improvement with controlled complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in light-emitting devices with regular edges and improved light distribution, reducing the risk of electrode damage and increasing production yield by controlling crack formation and maintaining the semiconductor stacks' integrity.
Implementation Method 1
forming specific laser inscribed marks on the substrate's dicing lines, with varying laser power and focal points to control crack formation
Data Source
AI summary
A light-emitting device includes a substrate and a semiconductor light-emitting stack. The substrate includes an upper surface, a first side surface, and a second side surface adjacent to the first side surface. The semiconductor light-emitting stack includes a first conductivity type semiconductor layer, a light-emitting layer, and a second conductivity type semiconductor layer that are sequentially disposed on the upper surface of the substrate in such order. The first side surface includes X number of first laser inscribed marks, and the second side surface includes Y number of second laser inscribed marks, in which Y>X>0 and Y≥3. A method for manufacturing the light-emitting device is also provided herein.