LED Terminal Plating for Stronger Substrate Bonding
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Solution Overview
Problem
Existing methods for manufacturing light emitting devices struggle to enhance the bonding strength between the light emitting element and the wiring part of the substrate.
Innovation Solution
A method involving the preparation of a light emitting element with a semiconductor structure, an electrode, and an external terminal with specific portions, followed by bonding with the substrate's wiring part and subsequent plating formation on the lateral faces of the external terminal portions, ensuring contact between the plating on the wiring part and the external terminal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional bonding methods are used to join the light emitting element and substrate wiring part, then the manufacturing process is simple, but the bonding strength between the light emitting element and the wiring part is insufficient
Solution Approach 1:
The patent applies preliminary action by forming plating layers on the external terminal and wiring part before the bonding process. This pre-preparation of plating surfaces ensures that when bonding occurs, the plating layers can immediately interlock and form strong metallurgical bonds, thereby achieving enhanced bonding strength without significantly complicating the overall manufacturing process
Solution Approach 2:
The patent employs composite materials by creating a multi-layer structure consisting of the external terminal, plating layer, and wiring part. The plating layer acts as an intermediate composite material that enhances the bonding interface between the light emitting element and substrate, providing both mechanical strength and electrical conductivity while resolving the contradiction between bonding strength and manufacturing complexity
2Strength
If the external terminal has sufficient thickness for structural integrity, then mechanical strength is maintained, but the plating cannot effectively bridge the space between the external terminal and wiring part
Solution Approach 1:
The patent applies dimensionality change by extending the plating layer not only on the surface but also into the lateral faces and gaps of the external terminal. This three-dimensional plating structure allows the plating to bridge the space between the external terminal and wiring part effectively, achieving strong bonding without requiring the external terminal to be thinner
3Strength
If plating is formed only on the surface of the external terminal, then the manufacturing process is simple, but the bonding strength and electrical connection are insufficient
Solution Approach 1:
The patent applies segmentation by dividing the plating formation process into distinct regions: the surface of the external terminal, the lateral faces of the external terminal, and the wiring part. This segmented approach allows each region to be plated optimally, ensuring comprehensive coverage and strong bonding while maintaining a manageable manufacturing process through systematic region-by-region plating
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method significantly enhances the bonding strength between the light emitting element and the substrate's wiring part, improving the reliability and performance of the light emitting device.
Implementation Method 1
forming plating on the lateral faces of the first portion and the lateral faces of the second portion continuously
Data Source
AI summary
A method of manufacturing a light emitting device includes: preparing a light emitting element comprising an external terminal having a first portion located on a semiconductor structure side and a second portion disposed on the first portion, wherein an area of the second portion is less than an area of the first portion; preparing a substrate having a wiring part; bonding the light emitting element and the wiring part by bringing the second portion of the external terminal into contact with the wiring part; and subsequent to bonding the light emitting element and the wiring part, forming plating continuously on lateral faces of the first and second portions, wherein a thickness of the second portion is 5 μm at most, and wherein the plating is formed such that the plating formed on the wiring part is in contact with the plating formed on the first portion.