LED Arrangement with Thermal Conduction and Convection Cooling
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Solution Overview
Problem
Existing light-emitting diode (LED) arrangements in motor vehicle headlamps face inefficiencies in heat management, leading to reduced performance and reliability due to inadequate cooling mechanisms.
Innovation Solution
The proposed LED arrangement incorporates thin-film light-emitting diode chips with a heat-conducting carrier and a cooling apparatus that utilizes thermal conduction and convection to efficiently manage heat, along with optical elements to reduce radiation divergence and enhance radiation intensity, and optionally includes luminescence conversion materials for wavelength adjustment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional cooling mechanisms are used in LED arrangements, then the structure is simpler, but heat dissipation efficiency is insufficient leading to reduced performance and reliability
Solution Approach 1:
The patent combines multiple cooling mechanisms (conduction, convection, and radiation) into a single integrated cooling apparatus. The cooling device includes a heat-conducting element in thermal contact with the LED chip, a cooling fluid channel for convection, and a high-emissivity coating for radiation, all merged into one system that efficiently dissipates heat through multiple pathways simultaneously.
Solution Approach 2:
The cooling apparatus serves multiple functions: it conducts heat away from the LED chip, enables convective heat transfer through fluid circulation, and facilitates radiative heat dissipation through the high-emissivity coating. This multi-functional design addresses the contradiction by providing comprehensive cooling capability without requiring separate independent systems.
2Power
If LED chips operate at high power, then light output is improved, but heat generation increases requiring more sophisticated cooling
Solution Approach 1:
The patent converts the harmful heat generated by high-power LED operation into a manageable thermal flow by implementing a comprehensive cooling system. The high-emissivity coating (emissivity ≥ 0.8) specifically enhances radiative heat dissipation, turning the waste heat problem into an efficient heat rejection mechanism that enables sustained high-power operation without excessive temperature rise.
Solution Approach 2:
The patent changes the thermal parameters of the cooling system by using materials and structures with optimized thermal properties: high thermal conductivity materials for heat conduction, high-emissivity coatings for enhanced radiation, and controlled fluid flow for efficient convection. These parameter optimizations allow the LED to operate at high power while maintaining acceptable junction temperatures.
3Illumination intensity
If optical elements are added to reduce radiation divergence, then light intensity is enhanced, but device complexity increases
Solution Approach 1:
The optical element is designed to perform multiple functions: it redirects divergent radiation to enhance light intensity in the desired direction, and it is integrated with the cooling apparatus structure. This multi-functional design provides optical optimization without proportionally increasing overall device complexity, as the optical component shares structural support with the cooling system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively cools the LED chips, enhances radiation focus, and allows for the use of waste heat for de-icing or defrosting applications, improving the reliability and performance of motor vehicle headlamps.
Implementation Method 1
The transport of heat away from the light-emitting diode chip is in this case preferably carried out substantially by means of thermal conduction
Implementation Method 2
The cooling apparatus is in this case preferably suitable to carry away the heat by means of thermal conduction or convection
Implementation Method 3
Furthermore, it is possible for the cooling apparatus to be suitable to carry away the heat generated by the light-emitting diode chips from the heat-conducting element partly by means of thermal conduction and partly by means of convection
Data Source
AI summary
A light-emitting diode arrangement having at least one light-emitting diode chip (1), each light-emitting diode chip (1) being assigned at least one optical element (4). In addition, the light-emitting diode arrangement has at least one heat-conducting element (13) which is suitable to carry away the heat generated by the light-emitting diode chip, and at least one cooling apparatus which is suitable to carry heat away from the heat-conducting element. The light-emitting diode arrangement is particularly well suited, for example, to use in motor vehicle headlamps.