Light Emitting Device Thermal Management via Insulating Pad
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Solution Overview
Problem
Conventional light emitting devices face inefficiencies in heat dissipation, which can lead to reduced performance and lifespan due to inadequate thermal management.
Innovation Solution
The design incorporates a substrate with lead frames and heat conductors separated electrically, utilizing a heat transfer pad to thermally connect the lead frames to heat conductors, allowing for effective heat dissipation through a high conductivity material path while preventing electrical short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the lead frame is directly connected to the heat conductor for thermal management, then heat dissipation efficiency is improved, but electrical short circuit risk increases
Solution Approach 1:
The patent introduces a heat transfer pad as an intermediary component between the lead frame and heat conductor. This pad is thermally conductive to enable heat dissipation while being electrically insulating to prevent short circuits. The heat transfer pad thus mediates the thermal management function while maintaining electrical isolation, resolving the contradiction between heat dissipation efficiency and electrical safety.
2Reliability
If electrical connection is made between lead frame and heat conductor, then electrical functionality is improved, but thermal management efficiency decreases
Solution Approach 1:
The patent segments the functional requirements by separating electrical connection and thermal management into distinct components. The lead frame handles electrical connection while the heat conductor handles thermal management. The heat transfer pad bridges these segmented functions, allowing each component to optimize its specific function without compromising the other, thus resolving the contradiction between electrical functionality and thermal management efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation efficiency, ensuring the light emitting device operates effectively and prolongs its lifespan by efficiently managing thermal issues.
Implementation Method 1
a heat transfer pad contacting the first lead frame and the heat conductor to thermally connect the first lead frame to the heat conductor
Data Source
AI summary
A light emitting device is provided. The light emitting device comprises a substrate, a first lead frame and a second lead frame on the substrate, a first light emitting diode, a heat conductor on the substrate, and a heat transfer pad. The first light emitting diode on the first lead frame is electrically connected to the first lead frame and the second lead frame. The heat conductor is electrically separated from the first lead frame. The heat transfer pad contacts the first lead frame and the heat conductor thermally to connect the first lead frame to the heat conductor.