Light Emitting Device Thermal Management via Intermediary Conductor
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Solution Overview
Problem
Existing light emitting devices with heat radiation patterns on inorganic material substrates face complexity in assembly and reduced heat radiation performance due to the need for direct contact with heatsinks, which complicates the configuration and increases assembly time.
Innovation Solution
A light emitting device design featuring a metalized pattern on the non-mounting surface of the inorganic material substrate, a conductor pattern on the mounting substrate, and an optical member with a heat absorbing surface to guide and radiate heat, allowing for efficient heat dissipation without direct contact with the heatsink.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat radiation pattern is formed on the rear side of an inorganic material substrate to thermally conduct heat from the light emitting diode element, then heat radiation performance is improved, but the structure becomes complex and assembly time increases due to the need for direct contact with heatsink or formation of through holes
Solution Approach 1:
The patent introduces a mounting substrate with a conductor pattern as an intermediary between the heat radiation pattern on the inorganic material substrate and the heatsink. The conductor pattern is bonded to the metalized pattern (heat radiation pattern) and provides a thermal conduction path to the heatsink, eliminating the need for direct contact or through holes in the mounting substrate. This intermediary structure simplifies the overall assembly while maintaining effective heat radiation performance.
2Temperature
If through holes are formed in the mounting substrate to bring the heat radiation pattern into contact with the heatsink, then heat radiation performance is improved, but assembly complexity and manufacturing difficulty increase
Solution Approach 1:
The mounting substrate with conductor pattern serves as a mediator that provides thermal conduction without requiring through holes. The conductor pattern is formed on the mounting substrate and bonded to the metalized pattern, creating a thermal pathway that avoids the need for penetrating the mounting substrate. This eliminates complex drilling and assembly operations while maintaining effective heat transfer to the heatsink.
3Temperature
If direct contact between heat radiation pattern and heatsink is required, then heat radiation performance is improved, but the configuration becomes complex and assembly time increases
Solution Approach 1:
The conductor pattern on the mounting substrate acts as an intermediary that provides thermal conduction between the heat radiation pattern and the heatsink without requiring direct contact. This allows for simplified assembly where the mounting substrate is simply bonded to the inorganic material substrate, and the heatsink is attached to the conductor pattern, significantly reducing assembly steps and time while maintaining effective heat radiation performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design simplifies the configuration, enhances heat radiation performance, and reduces assembly complexity by diffusing heat through a wider area, thereby minimizing the influence of heat resistance and improving overall thermal management.
Implementation Method 1
heat generated in the light emitting diode element is thermally-conducted from the heat radiation pattern to a heatsink
Implementation Method 2
a heat absorbing surface at least a part of which faces the conductor pattern of the mounting substrate
Implementation Method 3
a heat radiating surface that radiates heat of the light source conducted from the conductor pattern via the heat absorbing surface
Data Source
AI summary
A light emitting device includes a light source including an inorganic material substrate, a light emitting element mounted on a mounting surface of the inorganic material substrate, and a metalized pattern formed on a non-mounting surface of the inorganic material substrate on which the light emitting element is not mounted, a mounting substrate including an mounting surface on which the light source is mounted, and a conductor pattern formed on the mounting surface and bonded to the metalized pattern, and an optical member disposed on the mounting surface of the mounting substrate so as to guide a light emitted from the light source in a predetermined direction. The optical member includes a heat absorbing surface at least a part of which faces the conductor pattern of the mounting substrate, and a heat radiating surface that radiates heat of the light source conducted from the conductor pattern via the heat absorbing surface.