LED Contact Structure With Through-Hole Adhesive for Lower Resistance
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Solution Overview
Problem
Conventional LED devices have high operating voltage due to increased series resistance caused by the adhesive layer's higher resistance compared to the ohmic contact element, which is exacerbated by the lack of direct contact between the reflective layer and the ohmic contact element.
Innovation Solution
The LED device incorporates a light transmittable dielectric element with through holes exposing the semiconductor contact surface, an adhesive layer with corresponding through holes, and a metal contact element that extends into these holes to directly contact the semiconductor unit, reducing series resistance by allowing the reflective part to be in direct electrical contact with the ohmic contact element.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If an adhesive layer is disposed between the reflective layer and the light transmittable dielectric layer to firmly bond them, then the bonding strength is improved, but the series resistance increases due to the adhesive layer's higher resistance compared to the ohmic contact element
Solution Approach 1:
The adhesive layer is segmented by forming through holes through it, allowing the metal contact element to penetrate and create direct electrical contact paths that bypass the high-resistance adhesive material, thus reducing series resistance while maintaining bonding in the remaining adhesive regions
Solution Approach 2:
The metal contact element acts as an intermediary conductor that bridges the electrical connection between the reflective layer and the light transmittable dielectric layer, bypassing the adhesive layer's high resistance and providing a low-resistance electrical pathway
2Stability of the object's composition
If the reflective layer does not directly contact the ohmic contact element, then the structural integrity and bonding are improved, but the operating voltage increases due to increased series resistance
Solution Approach 1:
The adhesive layer is divided by through holes that expose the semiconductor contact surface, creating discrete electrical contact pathways that reduce resistance while preserving the overall layered structural integrity through the adhesive regions between holes
Solution Approach 2:
The metal contact element is nested within the through holes of the adhesive layer, extending from the reflective layer through the adhesive layer to contact the semiconductor, creating a hierarchical structure that maintains bonding while enabling direct electrical contact
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables the LED device to operate at a lower voltage while maintaining efficient light reflection and extraction, improving overall performance by minimizing light absorption and enhancing adhesion between layers.
Implementation Method 1
The reflective layer 102 is configured to reflect light from the epitaxial structure toward a light emitting surface of the epitaxial structure opposite to the reflective layer 102
Implementation Method 2
an adhesive layer 103 which is usually made of indium zinc oxide (IZO) or indium tin oxide (ITO) may be interposed between the reflective layer 102 and the light transmittable dielectric layer 104 to firmly bond the reflective layer 102 and the light transmittable dielectric layer 104
Data Source
AI summary
A light-emitting diode device includes an epitaxial structure that contains first-type and second-type semiconductor units and an active layer interposed therebetween, a light transmittable dielectric element that is disposed on the first-type semiconductor unit opposite to the active layer and is formed with a first through hole, an adhesive layer that is disposed on the dielectric element and is formed with a second through hole corresponding in position to the first through hole, and a metal contact element that is disposed on the adhesive layer. The adhesive layer has a thickness of at most one fifth of that of the dielectric element. The metal contact element extends into the first and second through holes, and electrically contacts the first-type semiconductor unit. A method for manufacturing the LED device is also disclosed.