LED Device Thermal Dissipation via Through-Hole PCB Mounting
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Solution Overview
Problem
High power light emitting diodes (LEDs) generate significant thermal energy, posing a challenge for effective heat dissipation, which is crucial for their efficiency and longevity.
Innovation Solution
A light emitting diode device incorporating a flexible printed circuit board with conducting units and through holes, where light emitting diodes are positioned within these holes, and a heat conducting layer made of insulating material is used to facilitate thermal energy transfer from the LEDs to a housing, enhancing heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If high power LEDs are used to provide greater illumination efficiency, then illumination intensity is improved, but thermal energy increases and heat dissipation becomes more difficult
Solution Approach 1:
The patent transitions from conventional planar heat dissipation to three-dimensional heat dissipation by positioning LEDs vertically within through-holes of the circuit board. This vertical arrangement enables heat to be conducted upward through the LED body to the front surface, creating additional heat dissipation pathways in the vertical dimension rather than relying solely on horizontal conduction through the PCB.
Solution Approach 2:
The patent introduces a heat-conducting adhesive layer as an intermediary substance between the LED bottom surface and the circuit board, and between the LED side surface and the PCB. This adhesive mediator enhances thermal coupling and facilitates more efficient heat transfer from the LED junction to the PCB heat dissipation structures.
2Device complexity
If conventional PCB mounting is used, then device complexity is reduced, but heat dissipation efficiency is insufficient
Solution Approach 1:
The patent segments the circuit board by creating through-holes that pass completely through the PCB thickness. This segmentation allows LEDs to be mounted within the board volume rather than only on the surface, dividing the heat dissipation function between the front surface (LED light output) and the rear surface (heat sink interface).
Solution Approach 2:
The patent merges multiple functions into the circuit board structure: the PCB serves simultaneously as the electrical connection substrate, the mechanical mounting structure, and the primary heat dissipation path. The through-holes integrate the LED mounting cavities with the heat conduction channels, combining structural and thermal management functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively dissipates thermal energy generated by the LEDs to the outside, improving their operational efficiency and longevity by utilizing the heat conducting layer and conducting units to transfer heat away from the device.
Implementation Method 1
a heat conducting layer made of insulating material is used to facilitate thermal energy transfer from the LEDs to a housing, enhancing heat dissipation
Data Source
AI summary
A display device includes a housing, a panel unit disposed in the housing, a light emitting diode module disposed between the housing and the panel unit, and a heat conducting layer. The light emitting diode module includes a circuit board, and a plurality of light emitting diodes disposed on the circuit board. The circuit board includes a board body formed with a plurality of through holes, and a first conducting unit and a second conducting unit disposed on the board body. Each of the light emitting diodes has a bottom portion disposed in a respective one of the through holes, and is coupled between each conducting parts of the first and second conducting units. The heat conducting layer contacts the housing, contacting parts of the first and second conducting units, and the bottom portions of the light emitting diodes.