Surface Mounted LED Light Routing via Circuit Board Through Hole

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Solution Overview

Problem

Conventional power supply devices using insertion mounted LEDs for operation state confirmation face challenges in miniaturization and assembly efficiency, with visibility issues due to light emission being obscured by the wiring board when switching to surface mounted LEDs.

Innovation Solution

A power supply device design featuring a surface mounted LED on the rear surface of a circuit board with a through hole adjacent to the LED, allowing light to pass through and be dispersed or reflected towards an open area of the chassis, enhancing visibility and using automated mounting for improved efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If an insertion mounted LED is used for displaying operation state, then the LED can be securely mounted on the wiring board, but the device size increases and assembly efficiency decreases

Engineering Contradiction:
Improvemounting securityVSAvoidassembly efficiency
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent replaces the mechanical insertion mounting method with a surface mounting method. The LED is mounted on the surface of the wiring board and electrically connected through conductive adhesive or solder paste applied to the mounting electrodes, eliminating the need for insertion holes and mechanical fixation, thereby improving assembly efficiency while maintaining reliable electrical connection

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the mounting parameters by transitioning from insertion mounting (requiring holes through the board) to surface mounting (requiring only surface electrodes). This parameter change allows for smaller device size and automated assembly processes, improving both productivity and compactness

Inventive Principle:
Principle #35Parameter changes

2Productivity

If a surface mounted LED is used on the front surface of the wiring board, then assembly efficiency improves, but light visibility deteriorates due to shading by the wiring board

Engineering Contradiction:
Improveassembly efficiencyVSAvoidlight visibility
Core Design Contradiction:
ProductivityVSIllumination intensity

Solution Approach 1:

The patent inverts the conventional mounting approach by placing the LED on the rear surface of the wiring board instead of the front surface. The light emitting surface faces the rear surface, allowing light to be emitted away from the front surface shading, thereby maintaining good visibility while preserving the benefits of surface mounting for assembly efficiency

Inventive Principle:
Principle #13The other way round (Inversion)

Solution Approach 2:

The patent utilizes the third dimension (depth/thickness) of the wiring board by mounting the LED on the rear surface. This dimensional relocation allows light to escape in a direction away from the front surface, avoiding the shading problem while maintaining surface mounting advantages

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Illumination intensity

If an insertion mounted LED is used, then light can be emitted from the front surface, but manufacturing complexity increases due to connection terminal insertion and soldering

Engineering Contradiction:
Improvelight visibilityVSAvoidmanufacturing complexity
Core Design Contradiction:
Illumination intensityVSDevice complexity

Solution Approach 1:

The patent replaces the mechanical insertion and soldering process with a surface mounting process using conductive adhesive or solder paste. The LED mounting electrodes are directly connected to the wiring board electrodes through the conductive material, eliminating the need for insertion holes, terminal manipulation, and traditional soldering operations, thereby reducing manufacturing complexity

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution ensures improved manufacturing efficiency and secure visibility of the LED's light emitting state from the front surface, allowing for effective operation state confirmation without the need for additional reflective members, thus reducing costs.

Implementation Method 1

The through hole is provided adjacent (in a vicinity of) the surface mounted light emitting component so as to guide light emitted from the surface mounted light emitting component toward the opening of the chassis

Methodology Applied
Scientific EffectLight: Light

Implementation Method 2

the surface mounted light emitting component is configured with a light emitting member and an optical dispersion member attached to the light emitting member

Methodology Applied
Scientific EffectOptical dispersion: Dispersion (of waves)

Data Source

PatentUS9271408B2Power supply device
Publication Date: 2016.02.23 TDK CORP
  • US9271408B2 patent drawing
  • US9271408B2 patent drawing
  • US9271408B2 patent drawing

AI summary

A power supply device includes a circuit board that has an arrangement surface and a rear surface opposite to the arrangement surface and that has a through hole. An insertion mounted circuit component, a connector and a surface mounted light emitting component that is provided for confirming an operation of the power supply device are assembled on the arrangement surface. A chassis holds the circuit board from the sides and the rear surface of the circuit board and has an opening to expose the connector. The surface mounted light emitting component is surface mounted on the rear surface of the circuit board. The through hole is provided near the surface mounted light emitting component so as to guide light emitted from the surface mounted light emitting component toward the opening of the chassis.