Light-Transmissive Conductive Film with Through Holes for LED Light Extraction

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Solution Overview

Problem

Existing light-emitting elements face challenges in enhancing light extraction efficiency due to absorption of light by the electrode, which limits their output and performance.

Innovation Solution

A light-emitting element structure featuring a substrate, semiconductor stacked body, light transmissive conductive film with through holes, insulation films in the holes, and pad electrodes is developed, where the insulation films reduce light absorption by the pad electrodes by reflecting light back into the semiconductor stacked body, thereby improving light extraction efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If a light transmissive conductive film is formed on the entire surface of the p-type semiconductor layer to diffuse electric current, then the current diffusion is improved, but the light extraction efficiency is reduced due to absorption by the electrode

Engineering Contradiction:
Improvecurrent diffusionVSAvoidlight extraction efficiency
Core Design Contradiction:
Ease of operationVSLoss of energy

Solution Approach 1:

The conductive film is segmented by forming through-holes that penetrate it, creating a multi-layer structure with insulation films and pad electrodes. This segmentation allows light to be extracted through the through-holes while the surrounding conductive film areas maintain current diffusion functionality, thus resolving the contradiction between current diffusion and light extraction efficiency

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the device are assigned different functions: the conductive film areas provide current diffusion, while the through-hole regions provide light extraction pathways. The insulation films and pad electrodes are locally positioned to reflect light back into the semiconductor layer, creating local quality variations that optimize both current diffusion and light extraction in their respective zones

Inventive Principle:
Principle #3Local quality

2Loss of energy

If the p-side pad electrode is formed on an insulation film with an opening portion to improve light extraction efficiency, then the light extraction efficiency is improved, but the structural complexity increases

Engineering Contradiction:
Improvelight extraction efficiencyVSAvoidstructural complexity
Core Design Contradiction:
Loss of energyVSDevice complexity

Solution Approach 1:

Multiple functions are merged into a single integrated structure: the conductive film serves both current diffusion and structural support, the through-holes serve both as insulation barriers and light extraction pathways, and the pad electrodes serve both electrical connection and light reflection functions. This merging reduces structural complexity compared to separate components while maintaining improved light extraction efficiency

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This structure effectively reduces light absorption by the pad electrodes and enhances the overall light extraction efficiency of the light-emitting element, leading to improved output and performance.

Implementation Method 1

the insulation films reduce light absorption by the pad electrodes by reflecting light back into the semiconductor stacked body

Methodology Applied
Scientific EffectLight reflection: Reflection

Data Source

PatentUS9761761B2Light-emitting element
Publication Date: 2017.09.12 NICHIA CORP
  • US9761761B2 patent drawing
  • US9761761B2 patent drawing
  • US9761761B2 patent drawing

AI summary

A light-emitting element includes a semiconductor stacked body, a light transmissive conductive film disposed on the semiconductor stacked body, the light transmissive conductive film including a plurality of through holes, insulation films disposed in the plurality of through holes, the plurality of through holes being disposed on the semiconductor stacked body; and a pad electrode disposed on the light transmissive conductive film and the insulation films.