LED Transfer Adhesive Layout for Faster Sub-Pixel Display Assembly
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Solution Overview
Problem
Existing display devices face challenges in efficiently transferring light emitting diodes (LEDs) to sub-pixels while minimizing transfer failures and reducing processing time, particularly in the context of next-generation display devices that utilize inorganic LEDs for improved reliability and efficiency.
Innovation Solution
A manufacturing method is employed where a selective transfer process is used, involving a donor with an adhesive layer having specific adhesive areas that overlap LEDs, allowing only partial transfer to sub-pixels, and a double-step process where non-transfer areas are exposed to light, enabling multiple transfers with one donor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional transfer process is used to transfer LEDs to sub-pixels, then the transfer process is simple, but transfer failures occur and processing time increases
Solution Approach 1:
The adhesive layer is divided into multiple regions with different adhesive properties: a first region with strong adhesive force for reliable LED attachment, and a second region with weak or no adhesive force to prevent unwanted transfers. This segmentation allows selective transfer of LEDs to specific sub-pixels while maintaining high transfer success rate and enabling efficient processing
Solution Approach 2:
Different regions of the adhesive layer are assigned different local qualities (adhesive strengths) to perform different functions. The first region provides strong adhesion for successful LED transfer, while the second region provides weak adhesion to allow easy removal or prevent misalignment. This local differentiation resolves the contradiction between ensuring transfer reliability and reducing processing time
2Productivity
If all LEDs are transferred at once, then processing time is reduced, but transfer precision decreases leading to failures
Solution Approach 1:
The adhesive layer is segmented into a first region for precise LED placement and a second region for easy removal or non-transfer. This allows all LEDs to be transferred simultaneously to the first region with high precision while the second region prevents unwanted transfers, thus maintaining both high productivity and manufacturing precision
Solution Approach 2:
The adhesive layer acts as an intermediary with spatially varying adhesive properties. It mediates between the donor substrate and sub-pixels, enabling selective attachment of LEDs to appropriate locations. This intermediary mechanism allows batch transfer while maintaining precision through the differentiated adhesive regions
3Ease of manufacture
If the adhesive layer has uniform adhesive force, then the transfer process is simple, but selective transfer of LEDs to specific sub-pixels cannot be achieved
Solution Approach 1:
The adhesive layer exhibits local quality variations with different adhesive strengths in different regions. The first region has strong adhesive force for reliable LED attachment, while the second region has weak adhesive force for easy removal or non-transfer. This local differentiation enables selective transfer capability while maintaining relatively simple fabrication processes
Solution Approach 2:
The adhesive properties of the adhesive layer are changed spatially to create regions with different adhesive forces. This parameter variation (adhesive strength) across different regions of the adhesive layer enables selective transfer of LEDs to specific sub-pixels while keeping the overall structure simple and manufacturable
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces transfer failures and minimizes processing time by ensuring selective and efficient transfer of LEDs to sub-pixels, facilitating a simplified and faster production process.
Implementation Method 1
the adhesive layer may include a plurality of first areas configured to overlap the plurality of light emitting diodes, a plurality of non-attachment areas disposed respectively to be adjacent to the first areas
Implementation Method 2
disposing a mask on the adhesive layer and irradiating light; and transferring the plurality of light emitting diodes on the donor to a display panel, wherein the adhesive layer may be included of a plurality of first areas that overlap the mask and a non-attachment area which is exposed from the mask and to which light is irradiated
Data Source
AI summary
The present disclosure relates to a display device and manufacturing method thereof. A display device includes a substrate in which a pixel including a plurality of sub pixels is included. The display device includes a first planarization layer disposed on the substrate and configured to have an opening. The display device includes an adhesive layer disposed on the first planarization layer. The display device includes a plurality of light emitting diodes disposed on the adhesive layer in each of the plurality of sub pixels. The adhesive layer includes a plurality of first areas configured to overlap the plurality of light emitting diodes, a plurality of non-attachment areas disposed respectively to be adjacent to the first areas, and a second area as a remaining part, except for the plurality of first areas and non-attachment areas.