LED Element Transfer Bonding for Corrosion-Resistant Connections
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Solution Overview
Problem
Existing light-emitting device manufacturing methods face challenges in ensuring high reliability during the transfer of light-emitting elements, particularly in maintaining electrical connections and preventing corrosion, which can lead to reduced device performance and lifespan.
Innovation Solution
A method involving the preparation of a support substrate with an adhesive layer and light-emitting elements, bonding these elements to a substrate with a bonding member, and subsequent heating to enhance adhesion, combined with metal plating to establish electrical connections, while using a light reflective member to improve light extraction efficiency and prevent corrosion by optimizing the shape and structure of metal plating parts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If light-emitting elements are transferred using conventional methods with multiple steps (forming bonding member, preparing carrier substrate, disposing on bonding member, removing carrier substrate), then the transfer process becomes complex and time-consuming, but reliability in transferring light-emitting elements is not sufficiently ensured
Solution Approach 1:
The invention separates the transfer process into distinct functional components: a support substrate with adhesive layer for mounting light-emitting elements, and a target substrate with bonding member for receiving them. This segmentation allows independent optimization of each component and simplifies the overall transfer process while maintaining high reliability.
Solution Approach 2:
The adhesive layer is pre-formed on the support substrate before the light-emitting elements are mounted. This preliminary action ensures that the bonding interface is ready in advance, eliminating the need for complex real-time bonding operations during transfer and improving both reliability and process simplicity.
2Reliability
If conventional transfer methods are used without additional bonding steps, then the manufacturing process is simpler, but electrical connections between light-emitting elements and substrate may be compromised
Solution Approach 1:
The invention merges the bonding function and electrical connection function into a single integrated bonding member. This bonding member simultaneously provides mechanical adhesion and electrical conductivity, eliminating the need for separate bonding and electrical connection steps while ensuring reliable electrical connections.
Solution Approach 2:
The bonding member is designed to perform multiple functions: mechanical bonding of the light-emitting element to the substrate and electrical connection between the element electrodes and substrate wiring. This multi-functionality simplifies the manufacturing process while maintaining high reliability of electrical connections.
3Reliability
If metal plating parts have conventional symmetric shapes, then manufacturing is easier, but corrosion resistance and electrical connection reliability are reduced
Solution Approach 1:
The metal plating parts are designed with asymmetric shapes that optimize their functional performance. The asymmetric geometry provides enhanced corrosion resistance by creating favorable stress distributions and improved electrical connection reliability through optimized contact areas, while remaining manufacturable using standard plating processes.
Solution Approach 2:
The metal plating parts have varying properties at different locations: thicker plating in areas requiring enhanced corrosion resistance and thinner plating where electrical connection is the primary function. This local quality optimization improves overall reliability while managing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures reliable transfer and bonding of light-emitting elements, enhances electrical connections, and reduces corrosion risks, leading to improved light extraction efficiency and extended device lifespan.
Implementation Method 1
an adhesive layer disposed on a first main surface of the support substrate
Implementation Method 2
bonding each of the plurality of light-emitting elements to the substrate with the bonding member interposed therebetween in a state in which the plurality of light-emitting elements and the substrate are heated at a first temperature
Implementation Method 3
heating the third structure at a second temperature equal to or higher than the first temperature
Data Source
AI summary
A method of manufacturing a light-emitting device includes: preparing at least one first structure including a support substrate, an adhesive layer, and light-emitting elements each having a first surface, and a second surface, and comprising a pair of element electrodes disposed on a second surface side; preparing a second structure including a substrate including a base and a plurality of pairs of wirings, and a bonding member disposed between a pair of wirings of the plurality of pairs of wirings; obtaining a third structure by causing the pair of element electrodes to face the pair of wirings and bonding each of light-emitting elements to the substrate with the bonding member interposed therebetween in a state in which the light-emitting elements and the substrate are heated at a first temperature; heating the third structure at a second temperature equal to or higher than the first temperature; and removing the support substrate from the third structure.