LED Transfer Assembly for Uniform Display Panel Placement
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Solution Overview
Problem
Current methods for transferring light emitting diodes to a target substrate, such as the pick and place method and laser transfer method, face issues with irregular placement, increased manufacturing time, and high costs due to visible wavelength distribution and complex processes, respectively.
Innovation Solution
A manufacturing method involving fluidic self-assembly where light emitting diodes are placed in a liquid on a first substrate, aligned using guide grooves, transferred to a second substrate using a stamper with adhesion heads, and thermally compressed to ensure stable contact, eliminating visible wavelength distribution and reducing manufacturing time and costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the pick and place method is used to transfer light emitting diodes to a target substrate, then the transfer process is relatively simple, but the wavelength distribution on the wafer becomes visible on the target substrate causing irregular placement
Solution Approach 1:
The patent introduces a transfer substrate as an intermediary between the wafer and the target substrate. The light emitting diodes are first transferred to the transfer substrate, where their positions are randomized to eliminate visible wavelength distribution patterns. From the transfer substrate, they are then transferred to the target substrate in a controlled manner, achieving both simple processing and regular placement.
2Manufacturing precision
If the laser transfer method is used to completely remove the wavelength distribution on the wafer, then the placement regularity is improved, but the manufacturing cost increases significantly
Solution Approach 1:
The transfer substrate serves as a cost-effective intermediary that randomizes the positions of light emitting diodes, eliminating the need for expensive laser processing to remove wavelength distribution patterns. This approach achieves placement regularity at lower manufacturing costs.
Solution Approach 2:
The transfer substrate is a temporary, disposable component used only during the transfer process. It performs the function of randomizing light emitting diode positions and then is discarded, providing a low-cost solution compared to expensive laser transfer methods.
3Reliability
If complex processes are used in the laser transfer method to transfer light emitting diodes without causing damage, then the reliability of transfer is improved, but the manufacturing time increases
Solution Approach 1:
The transfer substrate provides a stable intermediate platform that simplifies the transfer process. Light emitting diodes are first mounted on the transfer substrate under controlled conditions, then transferred to the target substrate in batches, reducing the need for complex real-time damage prevention measures and decreasing manufacturing time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for stable and efficient placement of light emitting diodes on the target substrate, reducing manufacturing time and costs while preventing visible wavelength distribution, thereby improving the manufacturing process for display panels.
Implementation Method 1
performing fluidic self-assembly to attach the plurality of light emitting diodes to the first substrate
Implementation Method 2
putting a plurality of light emitting diodes into the liquid in which the first substrate is put; performing fluidic self-assembly to attach the plurality of light emitting diodes to the first substrate
Implementation Method 3
thermally compressing the plurality of light emitting diodes transferred to the second substrate onto the second substrate
Implementation Method 4
thermally compressing the plurality of light emitting diodes transferred to the second substrate onto the second substrate
Implementation Method 5
performing hydrophilic surface processing on a portion of the first substrate and portions of the plurality of light emitting diodes
Data Source
AI summary
A display panel manufacturing method includes: putting a first substrate into a liquid; putting a plurality of light emitting diodes into the liquid in which the first substrate is put; performing fluidic self-assembly to attach the plurality of light emitting diodes to the first substrate; transferring the plurality of light emitting diodes attached to the first substrate to a second substrate; and thermally compressing the plurality of light emitting diodes transferred to the second substrate onto the second substrate.