LED Chip Transfer Layout for Pitch Scaling and Precise Alignment

The patent divides the large number of LED chips into multiple groups arranged in a matrix pattern on the carrier substrate. This segmentation allows the transfer process to handle chips in organized batches rather than individually, improving transfer efficiency while maintaining the required display quality through systematic arrangement and transfer of the segmented chip groups.

The patent pre-arranges LED chips in a precise matrix pattern on the carrier substrate before transfer, with predetermined pitches and spacing. This preliminary positioning establishes a reference framework that guides the transfer process, ensuring that when chips are transferred to the display substrate, their positions are accurately determined by the pre-established matrix arrangement, thereby achieving high positioning precision without requiring complex real-time measurement during transfer.

The patent employs a transfer substrate that can be dynamically adjusted and repositioned during the transfer process. The transfer substrate is designed to accommodate various pitch configurations, allowing the system to adapt to different LED chip spacing requirements. This dynamic capability enables the transfer process to handle reduced pitch arrangements effectively, maintaining ease of manufacture even when display density is increased through smaller chip spacing.