LED Transfer Process With Selective Adhesion for Pitch Alignment
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Solution Overview
Problem
Existing light-emitting diode semiconductor devices have limitations in manufacturing efficiency and display quality, leading to high production costs and suboptimal performance.
Innovation Solution
A method for manufacturing semiconductor devices involves forming light-emitting elements on a substrate and transferring them to another substrate with a pattern array, where the adhesive layer's adhesion force is selectively reduced to align and attach the elements, allowing for precise placement and improved pitch alignment between light-emitting elements and the pattern array.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If light-emitting elements are transferred directly from first substrate to final substrate, then manufacturing process is simple, but alignment precision and pitch matching are poor
Solution Approach 1:
The transfer process is divided into multiple intermediate stages using different substrates (first substrate, second substrate with pattern array, third substrate, fourth substrate). Each substrate serves a specific function in the sequence, allowing progressive refinement of alignment and pitch without requiring a single complex transfer operation.
Solution Approach 2:
Intermediate substrates act as mediators in the transfer process. The second substrate with the pattern array serves as a temporary carrier that enables precise pitch adjustment and alignment before final transfer to the fourth substrate. This intermediary approach resolves the contradiction by adding controlled complexity to achieve higher precision.
2Ease of operation
If adhesive layer adhesion force is high, then light-emitting elements are securely attached, but selective transfer and alignment become difficult
Solution Approach 1:
The adhesive layer is configured with spatially varying properties - it is formed in specific regions on the substrates with controlled adhesion forces. This allows selective transfer of light-emitting elements to specific locations while maintaining secure attachment where needed. The local variation in adhesive properties enables both easy selective transfer and reliable final attachment.
Solution Approach 2:
The adhesion force of the adhesive layer is dynamically adjusted during the transfer process. By controlling the adhesion force to be reduced in specific portions, the system transitions from a state of strong attachment to a state that allows selective release and transfer, then back to strong attachment for final positioning. This dynamic control resolves the contradiction between secure attachment and easy transfer.
3Adaptability or versatility
If pitch between light-emitting elements is fixed on first substrate, then manufacturing is simple, but adaptability to different pattern arrays is limited
Solution Approach 1:
The pitch adjustment is achieved by introducing an intermediate dimension - the second substrate with its pattern array. Instead of directly transferring elements with fixed pitch from the first substrate, the elements are transferred to the second substrate where the pattern array provides a new spatial arrangement with different pitch. This dimensional transition enables pitch adaptability without complicating the fundamental manufacturing process.
Solution Approach 2:
The pattern array is pre-formed on the second substrate before the light-emitting elements are transferred to it. This preliminary preparation of the receiving substrate with the desired pitch pattern allows flexible adaptation to different pitch requirements. The manufacturing process remains simple because each substrate is prepared in advance with its specific function, avoiding complex real-time adjustments.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances the yield and display quality of light-emitting diode semiconductor devices, reducing production costs and improving their performance by enabling more efficient transfer and alignment of light-emitting elements.
Implementation Method 1
forming a first pattern array on a second substrate, wherein the first pattern array includes an adhesive layer... transferring the plurality of light-emitting elements from the first substrate to the second substrate... reducing an adhesion force of a portion of the adhesive layer
Data Source
AI summary
A method for manufacturing a semiconductor device is provided. The method includes forming a plurality of light-emitting elements on a first substrate and forming a first pattern array on a second substrate, wherein the first pattern array includes an adhesive layer. The method also includes transferring the plurality of light-emitting elements from the first substrate to the second substrate and forming the first pattern array on a third substrate. The method includes transferring the plurality of light-emitting elements from the second substrate to the third substrate, and reducing an adhesion force of a portion of the adhesive layer. The method also includes forming a second pattern array on a fourth substrate, and transferring the plurality of light-emitting elements from the third substrate to the fourth substrate. The pitch between the plurality of light-emitting elements on the first substrate is different than the pitch of the first pattern array.