LED Transfer Layout With Selective Repair for Display Quality
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Solution Overview
Problem
The existing methods for transferring light-emitting units, such as LEDs, between different substrates in electronic device manufacturing face challenges due to insufficient knowledge and inefficiencies in the LED transfer process, leading to increased costs and potential defects.
Innovation Solution
A method involving selective and repair transfer processes is employed, where light-emitting elements are transferred to a substrate with defined regions, allowing for defect inspection and repair, reducing costs and ensuring good display quality by optimizing the placement and replacement of defective elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional LED transfer methods are used, then the transfer process can be completed, but the manufacturing cost increases and display quality may be compromised due to insufficient process knowledge and inefficiencies
Solution Approach 1:
The patent divides the LED transfer process into distinct stages: initial mass transfer of LEDs to the substrate, followed by defect inspection, and then selective repair transfer for defective regions. This segmentation allows optimization of each stage independently, improving overall reliability while controlling costs by applying different transfer methods to different regions based on quality requirements.
Solution Approach 2:
The patent performs a preliminary mass transfer of LEDs to the substrate before final positioning and defect repair. This preliminary action allows for bulk processing and cost reduction, while subsequent inspection and selective repair ensure high display quality for critical areas, resolving the contradiction between manufacturing cost and display quality.
2Productivity
If mass transfer process is used without selective transfer capability, then transfer speed is maintained, but defect detection and repair become difficult
Solution Approach 1:
The patent segments the transfer process into mass transfer phase (for speed) and selective repair phase (for precision). During mass transfer, LEDs are transferred in bulk to maintain high productivity. After inspection identifies defective regions, selective transfer is applied only to those specific areas, ensuring manufacturing precision without compromising overall transfer speed.
Solution Approach 2:
The patent introduces an intermediary inspection step between mass transfer and final assembly. This intermediary process detects defective LEDs, allowing the system to switch from high-speed mass transfer to precision-oriented selective transfer only where needed, thus maintaining both productivity and manufacturing precision.
3Reliability
If selective transfer is performed for every LED, then display quality is ensured, but the manufacturing process complexity and time increase
Solution Approach 1:
The patent applies selective transfer only partially - specifically to regions where defects are detected during inspection, rather than performing selective transfer on every LED. This partial action ensures display quality for critical areas while avoiding the time loss associated with universally applying the more time-consuming selective transfer process to all LEDs.
Solution Approach 2:
The patent performs preliminary mass transfer for all LEDs to establish baseline coverage quickly, then follows with targeted selective transfer only for defective regions identified during inspection. This preliminary action minimizes total process time while still ensuring display quality through subsequent precision repair of problematic areas.
Data Source
AI summary
An electronic device includes a substrate, a first organic portion, a first opening, a second organic portion, a second opening, a third organic portion and a first element. In a cross-section view, the first organic portion, the first opening, the second organic portion, the second opening and the third organic portion are disposed on the substrate and arranged in a first direction, the first opening is located between the first organic portion and the second organic portion, the second opening is located between the second organic portion and the third organic portion, the second organic portion is located between the first organic portion and the third organic portion, and a width of the first organic portion and a width of the third organic portion are less than a width of the second organic portion in the first direction. The first element is overlapped with the first opening.