LED Transfer via 90-Degree Rotation and Stamping

Instead of stacking semiconductor layers perpendicular to the substrate as in conventional methods, this patent inverts the approach by arranging LED structures laterally on the substrate and then transferring them using stampers. The semiconductor layers are formed parallel to the substrate first, then the entire LED structure is picked up and transferred in a horizontal orientation, eliminating the need for complex perpendicular stacking operations.

The patent transitions from a vertical stacking approach (perpendicular to substrate) to a lateral arrangement approach (parallel to substrate). By changing the dimensionality of layer arrangement from vertical to horizontal, the manufacturing process becomes simpler and reduces area loss during transfer operations.

The patent performs preliminary actions by pre-forming the LED structures with their semiconductor layers arranged parallel to the substrate before transfer. The stampers are designed with predetermined patterns that match the LED footprints, allowing direct pickup and transfer without complex in-process rotation or re-arrangement operations. This preliminary preparation simplifies the actual transfer process.

The patent introduces stampers as intermediary tools that facilitate the transfer process. The stampers act as mediators between the substrate and the target location, enabling simple lateral transfer of LED structures without requiring complex rotation mechanisms. The stamper temporarily holds the LED structure and transports it directly to the destination.