LED Display Colorization via Transfer Substrate Adhesion
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Solution Overview
Problem
Current methods for colorizing LED chips with high pixel density, such as ink jet printing, face limitations in printing accuracy and difficulty in coating quantum dots on small-sized pixels, preventing effective colorization.
Innovation Solution
A method involving an LED array substrate with a driving layer and LED chips, where light conversion blocks, including quantum dots, are fixed onto the LED chips using an adhesion layer, allowing for precise colorization by adhering a conversion plate with spaced quantum dots onto the LED chips and removing the substrate, enabling efficient colorization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If ink jet printing is used to colorize LED chips, then colorization can be achieved, but printing accuracy deteriorates and difficulty increases for high pixel density displays
Solution Approach 1:
The patent introduces a transfer substrate as an intermediary carrier. Quantum dots are first deposited onto this transfer substrate in a controlled manner, then transferred to the LED chip array. This intermediary step allows precise quantum dot placement without requiring direct high-precision printing on the final substrate, thereby resolving the contradiction between ease of manufacture and manufacturing precision.
2Ease of manufacture
If quantum dots are coated directly on small-sized pixels, then colorization can be achieved, but coating difficulty increases significantly
Solution Approach 1:
The patent segments the colorization process into two independent stages: (1) quantum dot deposition on transfer substrate, and (2) transfer to LED chips. This segmentation allows each stage to be optimized separately, reducing the complexity of coating small-sized pixels by performing the delicate operation on a more manageable transfer substrate first.
3Measurement precision
If higher pixel density is used, then display resolution is improved, but quantum dot placement accuracy becomes more difficult to achieve
Solution Approach 1:
The transfer substrate serves as a mediator that decouples the high-resolution LED chip array from the quantum dot deposition process. Quantum dots can be placed with sufficient accuracy on the transfer substrate, then the entire array is transferred as a unit to the LED chips, maintaining placement accuracy even at higher pixel densities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method achieves effective colorization of LED chips in high pixel density displays by accurately placing quantum dots on the LED chips, overcoming the limitations of existing techniques and ensuring reliable colorization.
Implementation Method 1
fixing the plurality of light conversion blocks on corresponded top surfaces of the plurality of LED chips by adhering a side of the conversion plate having the plurality of light conversion blocks with the side of the LED array substrate having the plurality of LED chips correspondingly
Implementation Method 2
The QD is photoluminescent, and therefore, combining the LED chip with QDs of various colors may achieve the colorization of the LED chip
Data Source
AI summary
A method for manufacturing an LED display device and an LED display device are provided. The method includes following operations. An LED array substrate and a conversion plate are provided. The LED array substrate includes a driving layer, a plurality of LED chips arranged in an array on a side of the LED array substrate having the driving layer. The conversion plate includes a substrate and a plurality of light conversion blocks, the plurality of light conversion blocks are spaced apart from each other and arranged on the substrate. A side of the conversion plate having the light conversion blocks is adhered with a side of the LED array substrate having the LED chips correspondingly, such that the light conversion blocks are arranged on corresponded top surfaces of the LED chips. The substrate is removed.