LED Package Trench Thermal Diffusion
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Solution Overview
Problem
Existing light emitting device packages face challenges in efficiently releasing heat, particularly due to limitations in forming narrow and deep trenches for thermal diffusion, which affects thermal emission efficiency and increases manufacturing costs.
Innovation Solution
The package body features a silicon substrate with a specific crystal orientation, utilizing an anisotropic wet etching process to create trenches with a vertical width greater than horizontal width, filled with metal layers to form cathode and anode leads, enhancing heat release and thermal emission efficiency through high heat conductivity metal layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional packaging structures are used, then manufacturing is simpler, but thermal emission efficiency is insufficient
Solution Approach 1:
The package body is divided into multiple trenches (first trenches and second trenches) with different functions. The first trenches contain metal layers for thermal management, while the second trenches form reflective cavities. This segmentation allows independent optimization of thermal emission and light reflection functions, resolving the contradiction between improved thermal efficiency and structural complexity.
Solution Approach 2:
The patent introduces vertical depth dimension by creating trenches that extend deep into the package body. The first trenches have depth greater than width, creating narrow and deep thermal diffusion paths. This dimensional change enables effective heat dissipation without increasing lateral footprint, addressing the thermal emission efficiency issue while maintaining compact packaging.
2Loss of energy
If narrow and deep trenches are formed for thermal diffusion, then thermal emission efficiency improves, but manufacturing cost increases
Solution Approach 1:
The package structure utilizes the natural reflective properties of the package body material (polymer or glass) to form reflective cavities without requiring additional reflective coating layers. The second trenches create air gaps or voids that inherently reflect light, eliminating the need for expensive metallic reflective coatings and simplifying the manufacturing process while maintaining optical performance.
Solution Approach 2:
The package body material serves multiple functions: structural support, thermal conduction pathway, and optical reflection surface. By designing the second trenches to create reflective cavities using the package body's inherent properties, the structure achieves both thermal management and optical functionality without requiring separate components, reducing manufacturing complexity and cost.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves thermal emission efficiency by increasing the percentage of high heat conductivity metal and forming a narrow and deep thermal diffusion layer at a lower cost, effectively addressing the heat release limitations in existing packages.
Implementation Method 1
the metal layers serve to release heat from the light emitting device chip
Implementation Method 2
The package body features a silicon substrate with a specific crystal orientation, utilizing an anisotropic wet etching process to create trenches with a vertical width greater than horizontal width
Data Source
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Figure 3
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AI summary
Provided are a light emitting device package and a lighting system comprising the same. The light emitting device package comprises a package body (110) having a trench, a metal layer (120) within the trench, and a light emitting device chip (160) over the metal layer.