LED Unit Thermal Release Structure for Lamp Adaptability
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Solution Overview
Problem
Existing LED lighting lamps face challenges in efficiently releasing heat generated by LED elements, leading to reduced emission efficiency and shorter operational life, and require costly design changes for different forms of lamps.
Innovation Solution
An LED unit with a base and circuit board made of high thermal conductivity materials, such as copper alloys, integrated with a light-transmitting resinous body to seal and efficiently release heat, allowing for a simple and cost-effective thermal-release structure applicable to various lamp forms.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the thermal-release structure is changed according to various forms of LED lighting lamp, then the LED lighting lamp can be adapted to different forms, but the manufacturing cost increases
Solution Approach 1:
The patent applies universality by designing a standardized LED unit with an integrated thermal-release structure that can be used across multiple lamp forms (tube lamps, downlights, spotlights, etc.). The LED unit includes a base with high thermal conductivity material and a heat dissipation structure that serves the same thermal management function regardless of the final lamp configuration, eliminating the need to redesign thermal-release structures for each lamp type.
Solution Approach 2:
The patent segments the LED lighting system into modular LED units that can be independently manufactured and then assembled into different lamp forms. Each LED unit is a self-contained module with its own thermal-release structure, allowing standardization at the module level while providing flexibility at the system level through different assembly configurations.
2Illumination intensity
If a large number of LED elements are assembled in one package to achieve high-light intensity, then the light emission intensity increases, but the heat generation and temperature rise increase
Solution Approach 1:
The patent merges the thermal management function directly into the LED unit structure by integrating a heat dissipation structure with high thermal conductivity material into the base of each LED unit. This consolidation ensures that heat from multiple LED elements is efficiently collected and dissipated through the integrated thermal management system, preventing temperature rise even when many LED elements are assembled in one package.
3Illumination intensity
If the drive current of the LED element is increased to achieve high-intensity light emission, then the light emission intensity increases, but the power loss and heat generation increase
Solution Approach 1:
The patent converts the harmful effect of heat generation into a manageable parameter by designing an integrated thermal-release structure with high thermal conductivity material. The structure is specifically designed to capture and channel the heat generated by high drive currents away from the LED elements, transforming the problematic heat into a controlled thermal flow that can be efficiently dissipated, thereby enabling high-intensity operation without excessive temperature rise or energy loss.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient heat dissipation within the LED unit itself, eliminating the need for design changes in thermal-release structures across different lamp forms, thus maintaining high emission efficiency and reducing manufacturing costs.
Implementation Method 1
a base having high thermal conductivity... a supporting member having high thermal conductivity... heat generated in the LED elements is released by the holder or supporting member
Data Source
AI summary
The present invention is an LED unit having a thermal-release structure including a base having high thermal conductivity, a circuit board which includes a wiring pattern and is provided on the base, at least one LED element which is electrically connected to the wiring pattern and disposed on the base, and a light-transmitting resinous body provided to cover above the base to seal the LED element.