Light-Emitting Device With Variable Conductive Layer Thickness
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Back-side emission-type light-emitting diodes face issues with uneven light distribution due to absorption of indirect light by conductive layers, leading to reduced light output on the lower side of the electrode and substrate.
Innovation Solution
A light-emitting device design featuring a transparent substrate with a conductive layer having distinct thickness portions, where the second conductive portion is thinner than the first, reducing light absorption and enhancing even light distribution by minimizing the influence of substrate carrier concentration on electrical characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conductive layer is formed on the substrate to suppress the influence of substrate carrier concentration on electrical characteristics, then electrical characteristics are improved, but light distribution becomes uneven due to absorption of indirect light
Solution Approach 1:
The conductive layer is designed with different thicknesses in different regions: a first thickness in the first region and a second thickness (greater than the first) in the second region. This local variation in thickness allows the conductive layer to have different light absorption characteristics in different regions, compensating for the uneven light distribution caused by substrate absorption while maintaining electrical functionality.
Solution Approach 2:
The invention changes the physical parameter of the conductive layer (thickness) to control light absorption. By increasing the thickness in the second region, more light is absorbed there, which compensates for the light that would otherwise be lost due to substrate absorption, thereby achieving more uniform light distribution across the device.
2Illumination intensity
If the conductive layer thickness is increased to compensate for light absorption, then light distribution uniformity is improved, but light output is reduced due to increased absorption
Solution Approach 1:
The conductive layer thickness is locally optimized: thinner in the first region where less compensation is needed, and thicker in the second region where more compensation is needed. This localized approach achieves light distribution uniformity without uniformly increasing absorption across the entire device, thereby minimizing energy loss.
Solution Approach 2:
The conductive layer thickness is increased only partially and only in the specific region where it is needed to compensate for substrate absorption, rather than increasing it uniformly across the entire device. This partial action achieves the necessary light distribution uniformity while avoiding excessive light absorption and energy loss.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves a more uniform light distribution and reduces the impact of substrate carrier concentration on forward voltage, enhancing the overall light-emitting performance and efficiency.
Implementation Method 1
a light emitting layer (13) on the first conductive portion (11)
Implementation Method 2
a transparent substrate (10) having a first surface (10a)
Implementation Method 3
a portion of emitted light is absorbed into the conductive layer, especially indirect light
Data Source
AI summary
A light-emitting device includes a substrate that is capable of transmitting light, a conductive layer that includes a first conductive portion provided on the substrate and a second conductive portion which is provided on the substrate so as to be adjacent to the first conductive portion, The second conductive portion is thinner than the first conductive portion. A light emitting layer is provided on the first conductive portion. A first electrode is provided on the second conductive portion. A second electrode is provided on the light emitting layer. In some embodiments, a backside surface of the substrate may be processed to be optically rough so as to limit internal reflections.


