LED Package with Via Hole Substrate and Bonding Layers
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Solution Overview
Problem
Conventional LED packages are limited in size reduction and design flexibility, with complex manufacturing processes that increase production costs and time, making mass production difficult.
Innovation Solution
A light emitting device package is fabricated by bonding an LED to a substrate with a mesa structure and via holes, using a bonding insulating pattern layer and a bonding metal pattern layer to increase bonding reliability and reduce residual stress, while performing manufacturing processes at the wafer level to simplify production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If an LED is mounted on a conventional package body as a separate chip, then the LED package can be assembled, but the package body size becomes relatively large compared to the LED, limiting size reduction
Solution Approach 1:
The patent merges the LED chip and package body into a single integrated structure where the LED is formed directly on the substrate with electrode pads and phosphor layers integrated into the substrate structure, eliminating the need for a separate package body and achieving significant size reduction
Solution Approach 2:
The substrate serves multiple functions simultaneously: it acts as the package body, provides electrical connections through via holes and electrode pads, supports the LED active layers, and contains the phosphor conversion elements, replacing multiple separate components with a single multi-functional substrate
2Productivity
If an LED is mounted as a separate chip on the package body, then assembly is possible, but mass production becomes difficult and the manufacturing process becomes complicated
Solution Approach 1:
The manufacturing process is segmented into wafer-level fabrication steps where multiple LED devices are fabricated simultaneously on a single substrate using semiconductor manufacturing techniques, enabling mass production through parallel processing rather than individual chip assembly
Solution Approach 2:
The electrode pads, via holes, and phosphor layers are prepared in advance during wafer fabrication before the LED active layers are formed, allowing subsequent bonding and assembly steps to be simplified and enabling high-volume production through pre-configured substrates
3Reliability
If conventional bonding methods are used without pattern layers, then bonding is simple, but bonding reliability is limited and residual stress increases
Solution Approach 1:
The bonding structure incorporates patterned insulating and metal layers at specific locations where bonding occurs, providing localized electrical isolation and mechanical reinforcement exactly where needed during the bonding process, while maintaining simplicity in non-bonding regions
Solution Approach 2:
The bonding insulating pattern layer and bonding metal pattern layer act as intermediary elements between the LED chip and substrate, facilitating reliable bonding by providing electrical isolation, mechanical support, and stress distribution during the bonding process
Data Source
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AI summary
A light emitting device (LED) package and a manufacturing method thereof are provided. The LED package includes an LED including a first electrode pad and a second electrode pad disposed on one surface thereof; a bonding insulating pattern layer configured to expose the first electrode pad and the second electrode pad; a substrate including a via hole bored from a first surface to a second surface and a wiring metal layer formed on an inner surface of the via hole to extend to a part of the second surface; and a bonding metal pattern layer bonded to the wiring metal layer exposed through the via hole at the first surface of the substrate and also bonded to the first electrode pad and the second electrode pad.