LED Package View Angle Control via Reflecting Wall Reflectivity
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Solution Overview
Problem
Current light-emitting package structures face challenges in achieving desired view angles efficiently, as existing methods require complex optical designs and manufacturing processes, leading to increased costs and reduced light intensity due to absorbing lateral light with reflecting walls.
Innovation Solution
The solution involves adjusting the thickness of the wavelength converting layer and the relative height of its top surface with respect to the reflecting wall, along with controlling the reflectivity of the reflecting wall, to achieve a predetermined view angle, thereby enhancing the flexibility of the optical design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If a reflecting wall is designed to surround the LED to reduce the view angle, then the view angle is reduced, but the reflecting wall absorbs lateral light emitted by the chips, thus reducing the light intensity and brightness
Solution Approach 1:
The patent converts the harmful absorption effect of the reflecting wall into a beneficial reflection effect by changing the inner surface from absorbing material to highly reflective material. The reflecting wall now reflects lateral light back toward the front surface instead of absorbing it, thereby maintaining light intensity while achieving view angle control through the wall's geometric structure.
Solution Approach 2:
The patent changes the optical parameters of the reflecting wall by adjusting the reflectivity of its inner surface and modifying its geometric parameters (height, thickness, curvature radius). These parameter changes enable the reflecting wall to control view angle while preserving light intensity through optimized reflection rather than absorption.
2Adaptability or versatility
If additional mold developments are necessary for achieving different view angles using bowl-type structures, then different view angles can be achieved, but the time and costs of the manufacturing process are increased
Solution Approach 1:
The patent makes a single mold structure universal by enabling it to produce LEDs with different view angles through adjustable parameters rather than requiring separate molds for each view angle. The reflecting wall's geometry (height, thickness, curvature) can be modified within the same mold to achieve various view angles, making the mold multi-functional and reducing manufacturing costs.
Solution Approach 2:
The patent introduces dynamic adjustability into the mold design, allowing the reflecting wall parameters to be changed during or between production runs. This dynamic capability enables the same mold to produce different view angles by adjusting wall height, thickness, or curvature, eliminating the need for static dedicated molds for each view angle specification.
3Shape
If secondary optical lenses with specific design are used in combination with specific view angles, then desired light patterns can be achieved, but the design and manufacture of the secondary optical lens increase manufacturing costs of the products
Solution Approach 1:
The patent merges the function of the secondary optical lens with the primary package structure by integrating view angle control and light pattern shaping directly into the reflecting wall and lens design of the LED package. This integration eliminates or reduces the need for separate secondary optical lenses, thereby reducing manufacturing costs while maintaining desired light patterns.
Solution Approach 2:
The patent makes the primary package structure multi-functional by designing the reflecting wall and lens to simultaneously achieve view angle control and light pattern shaping. This universal design replaces the need for additional specialized optical components, reducing overall manufacturing complexity and cost while maintaining optical performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the flexible adjustment of view angles in light-emitting package structures, reducing manufacturing costs and maintaining light intensity by minimizing the absorption of lateral light, resulting in a more concentrated and efficient light pattern.
Implementation Method 1
adjusting the thickness of a wavelength converting layer as a view angle adjusting structure
Implementation Method 2
the reflectivity of the reflecting wall
Data Source
AI summary
A method for forming a light-emitting package structure provided with a predetermined view angle is provided. The method includes the steps of: disposing a flip chip on a carrier substrate; filling an underfill material between at least two electrodes of the flip chip for supporting the flip-chip; laser lifting-off a growing substrate from the flip chip for forming a thin film chip and exposing an epitaxial structure from the thin film chip; roughening the epitaxial structure exposed from the thin film chip; providing a view angle adjusting structure including a wavelength converting layer on the thin film chip, and selecting a predetermined view angle and achieving the predetermined view angle by adjusting the view angle adjusting structure according to a linear regression formula.


