Laser Modified Regions for LED Wafer Separation
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Solution Overview
Problem
Current methods for manufacturing light-emitting elements face challenges in increasing productivity, particularly in efficiently separating wafers into individual light-emitting elements while minimizing unintentional separation and defects.
Innovation Solution
A method involving laser irradiation of a wafer with specific intervals and directions to form modified regions, allowing for precise separation into light-emitting elements by scanning the laser beam along first and second lines with distinct intervals, and subsequent separation along these lines to produce bars and then individual elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If laser irradiation is performed to form modified regions for separation, then separation precision is improved, but unintentional separation and defects occur reducing reliability
Solution Approach 1:
The patent applies local quality by creating modified regions with different properties at different locations. The laser irradiation creates modified regions inside the substrate at specific positions where separation is desired, while leaving other regions unchanged. This localized modification allows precise separation control without affecting the entire wafer, thus preventing unintentional separation and defects in non-target areas.
Solution Approach 2:
The patent applies preliminary action by forming modified regions inside the substrate before the actual separation process. The laser irradiation pre-processes the substrate by creating modified regions that facilitate subsequent separation along predetermined lines. This preliminary modification ensures that separation occurs only at intended locations with high precision, eliminating the need for forceful separation that could cause defects.
2Productivity
If wafer separation is performed to increase productivity, then manufacturing efficiency is improved, but defects and unintentional separation increase reducing quality
Solution Approach 1:
The patent applies segmentation by dividing the wafer separation process into two distinct stages: first separating the wafer into bars along first dividing lines, then separating bars into individual light-emitting elements along second dividing lines. This segmented approach allows each separation step to be optimized independently, maintaining high quality while improving overall productivity through systematic division of the separation process.
Solution Approach 2:
The patent applies preliminary action by creating modified regions inside the substrate before separation. These pre-formed modified regions serve as guides that enable subsequent separation to proceed smoothly along predetermined paths without causing defects or unintentional separation, thus maintaining high manufacturing precision while achieving improved productivity.
3Manufacturing precision
If laser beam scanning is performed with small intervals to prevent defects, then manufacturing precision is improved, but processing time increases reducing productivity
Solution Approach 1:
The patent applies segmentation by dividing the laser irradiation process into two distinct scanning operations: first scanning along first dividing lines to create modified regions for bar separation, then scanning along second dividing lines to create modified regions for element separation. This segmented irradiation approach allows each scanning operation to use optimal intervals for its specific purpose, achieving high precision without excessive processing time.
Solution Approach 2:
The patent applies partial action by performing laser irradiation only at specific locations where modified regions are needed for separation, rather than uniformly irradiating the entire wafer. The laser beam scans along predetermined first and second dividing lines with appropriate intervals, creating modified regions only where separation is required. This partial irradiation approach maintains high separation precision while minimizing processing time by avoiding unnecessary irradiation of non-separation areas.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances productivity by reducing unintentional separation and defects, increasing breaking strength, and facilitating the separation process while maintaining the quality of light-emitting elements.
Implementation Method 1
forming a plurality of modified regions inside a substrate of a wafer by irradiating the substrate with a laser beam
Implementation Method 2
irradiating the substrate with a laser beam, the wafer comprising: the substrate having a first surface and a second surface
Data Source
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AI summary
A method of manufacturing a light-emitting element includes: providing a wafer including: a substrate, and a semiconductor structure; forming a plurality of modified regions inside the substrate of the wafer by irradiating the substrate with a laser beam; and separating the wafer into a plurality of light-emitting elements after said irradiating the substrate with the laser beam. Said forming the plurality of modified regions includes: scanning the laser beam along a plurality of first lines, the plurality of first lines extending in a first direction and being arranged in a second direction, the first direction being parallel to the first surface, the second direction intersecting the first direction and being parallel to the first surface, and scanning the laser beam along a plurality of second lines, the plurality of second lines extending in the second direction and being arranged in the first direction.