LED Wafer Picker Guide Member with Central Hole
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Solution Overview
Problem
Conventional LED wafer pickers face issues with reduced suction force and risk of contamination due to direct contact with the wafer surface, leading to potential defects from foreign substances.
Innovation Solution
An LED wafer picker design featuring a streamlined discharge surface with a single central hole in the guide member and a support portion with an inclined taper to prevent contact, increasing suction force and maintaining the wafer at a safe distance, thus reducing contamination risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a non-contact type LED wafer picker is used based on the Bernoulli's principle, then the LED wafer surface is protected from contamination and damage, but the suction force is reduced due to the fine holes in the guide member
Solution Approach 1:
The guide member is divided into two functional zones: an upper portion with fine holes for non-contact adsorption protection, and a lower portion with a large central hole for enhanced suction force. This segmentation allows each zone to perform its specific function optimally without compromising the other.
Solution Approach 2:
Different portions of the guide member are given different hole configurations tailored to their specific functions. The upper portion near the discharge surface has fine holes for protection, while the lower portion has a large central hole for suction, creating local quality variations that optimize overall performance.
2Reliability
If the LED wafer is held in an adsorbed state close to the discharge surface, then stable adsorption is achieved, but the top surface of the LED wafer may come into contact with the guide member causing contamination
Solution Approach 1:
The problem of wafer-guide member contact is solved by adding a vertical dimension to the hole configuration. The large central hole extends downward from the fine holes, creating a three-dimensional structure that maintains the protective barrier while allowing sufficient suction force, thus preventing contact without compromising adsorption stability.
3Object-affected harmful factors
If multiple fine holes are used in the guide member, then non-contact adsorption is achieved, but the number of parts increases and maintenance becomes more complex
Solution Approach 1:
The guide member combines multiple hole types (fine holes and large central hole) into a single integrated component. This merging reduces the total number of separate parts while maintaining the protective non-contact adsorption function, thereby simplifying the overall device structure and reducing maintenance complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances suction force, preventing contamination and defects by maintaining the LED wafer at a safe distance and reducing the number of parts for simplified maintenance and cost-effectiveness.
Implementation Method 1
The non-contact type LED wafer picker may enable compressed air to quickly flow along a streamlined discharge surface, so that an LED wafer may be held in an adsorbed state at a predetermined distance from the discharge surface
Data Source
AI summary
A light-emitting diode (LED) wafer picker that may increase a suction force and may perform stable adsorption without a concern for contact with a top surface of an LED wafer is provided. An LED wafer picker may include a main body to hold, in an adsorbed state, an LED wafer disposed below the main body, when air drawn in from a top of the LED wafer picker is discharged along a streamlined discharge surface to both sides of the LED wafer picker, a guide member to enable the air to flow along the discharge surface, the guide member being disposed below the discharge surface, a single central hole formed in a central portion of the guide member, excluding a portion facing the discharge surface, and a support portion to support the LED wafer, the support portion extending downward from the guide member. Accordingly, it is possible to easily perform adsorption of an LED wafer that is relatively far from the LED wafer picker. Additionally, it is possible to prevent the top surface of the LED wafer from coming into contact with the guide member, thereby reducing detects due to contamination of foreign substances.