LED Wafer Detection via Segmented Test Contacts
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Solution Overview
Problem
Conventional LED detection devices and methods are inadequate for enhancing color performance in display devices, as they fail to effectively utilize the full potential of LED chips for light emission and detection.
Innovation Solution
An LED wafer detection device and method that includes a wafer base with LED chips, positive and negative test circuit layers, and corresponding test contacts, where an electric current is input through positive test contacts and output through negative test contacts to excite each LED chip, generating a light source that is optically detected by a light-detecting module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional LED detection devices are used, then the detection process is simple, but the color performance enhancement is insufficient
Solution Approach 1:
The patent divides the LED wafer into multiple individual LED chips, each with separate positive and negative contacts. This segmentation allows for individual detection of each LED chip's light emission properties, enabling precise color performance measurement while maintaining a relatively simple overall device structure through parallel processing capability.
Solution Approach 2:
The patent introduces a light-detecting module as an intermediary component between the LED chips and the detection system. This module captures light emitted by individual LED chips, enabling accurate color performance detection without requiring complex direct measurement apparatus, thus balancing measurement precision with device simplicity.
2Measurement precision
If individual LED chip detection is implemented, then detection accuracy improves, but detection time increases
Solution Approach 1:
The patent segments the LED wafer into multiple independently detectable LED chips with separate contact structures. This segmentation enables parallel detection of multiple chips simultaneously, improving overall detection throughput while maintaining individual chip detection accuracy, thus reducing total detection time without sacrificing precision.
Solution Approach 2:
The patent incorporates test circuit layers and test contacts during the LED chip manufacturing process on the wafer. This preliminary integration of detection structures eliminates the need for additional setup or preparation steps before detection, allowing immediate and efficient individual chip detection, thereby reducing detection time while maintaining accuracy.
3Measurement precision
If full-color LED display device is constructed, then color performance is enhanced, but manufacturing complexity increases
Solution Approach 1:
The patent divides the full-color LED display into multiple individual LED chips (red, green, blue) that can be manufactured separately on the wafer and then assembled. This segmentation allows for specialized manufacturing of each color type while maintaining overall production efficiency, enhancing color performance through precise control of individual chip properties without excessive manufacturing complexity.
Solution Approach 2:
The patent designs a universal test contact structure that can detect multiple parameters (light emission, color properties) across different LED chip types. This multi-functional contact design simplifies the manufacturing process by using the same detection infrastructure for various LED chips, enabling full-color display construction without proportionally increasing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the effective excitation and detection of light sources from each LED chip, improving the detection efficiency and enhancing the color performance of LED display devices by utilizing the LED chips' full potential.
Implementation Method 1
each LED chip is excited to generate a light source
Implementation Method 2
each LED chip is excited to generate a light source
Implementation Method 3
the light source generated by each LED chip is optically detected by the light-detecting module
Data Source
AI summary
An LED wafer, an LED wafer detection device and an LED wafer detection method are provided. The LED wafer includes a wafer base, a plurality of LED chips, a plurality of positive test circuit layers, a plurality negative test circuit layers, a plurality of positive test contacts, and a plurality of negative test contacts. Each LED chip has a positive contact and a negative contact respectively electrically connected to the corresponding positive test circuit layer and the corresponding negative test circuit layer. The positive test contacts are respectively electrically connected to the positive test circuit layers, and the negative test contacts are respectively electrically connected to the negative test circuit layers. Whereby, when inputting an electric current into the positive test contacts, and then outputting the electric current from the negative test contacts, each LED chip is excited to generate a light source.