Wall-Mounted LED Lighting Device Thermal Management
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Solution Overview
Problem
Existing wall-mounted lighting devices with LED light sources face inefficiencies due to heat dissipation issues, which reduce energy efficiency and LED lamp lifespan.
Innovation Solution
The lighting device features a base plate with a printed circuit substrate that directly faces the wall, allowing for direct heat removal through air flow or conduction, eliminating intermediate insulation and incorporating a translucent envelope with fixing means for optimal heat management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a metallic base with heat transfer function is used, then heat dissipation is improved, but the LED lamp temperature reduction is insufficient
Solution Approach 1:
The patent merges the printed circuit board substrate with the base plate structure, creating an integrated thermal management system where the PCB serves dual functions as both electrical circuit carrier and heat dissipation component. This integration eliminates intermediate insulation layers and directly couples the LED heat source to the wall-mounted base plate, achieving more effective heat removal while extending LED lifespan and maintaining energy efficiency.
2Temperature
If an intermediate support with insulation function is used to fix the light source, then the light source is securely mounted, but heat removal is impeded
Solution Approach 1:
The patent combines the mounting support function and the printed circuit board into a single integrated structure. The base plate itself serves as both the mechanical support for mounting the LED light source and the thermal conduction path to the wall, eliminating the need for separate intermediate insulating supports and simplifying the overall device structure while improving heat removal efficiency.
Solution Approach 2:
The patent extracts the insulation function from the mechanical support structure, removing intermediate insulating layers that previously blocked heat transfer. By direct-contact mounting the LED to the thermally conductive base plate/PCB assembly, the design eliminates unnecessary thermal barriers while maintaining secure mechanical fixation.
3Temperature
If the printed circuit substrate directly faces the wall, then heat removal is enhanced, but the circuit board may be damaged by wall contact
Solution Approach 1:
The patent merges the base plate and printed circuit board substrate into an integrated structure where the PCB forms part of the thermal management system. This integration allows the circuit board to directly face the wall for heat dissipation while the unified construction provides inherent mechanical protection and structural support, preventing damage from wall contact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively extends the LED lamp's lifespan and improves energy efficiency by ensuring efficient heat dissipation, either through air flow or direct contact with the wall, thereby enhancing the lighting assembly's performance.
Implementation Method 1
Heat from the light assembly is conducted away into the wall
Implementation Method 2
The heat from the device is evacuated via the flow of outside air circulating in the space between the wall and the lighting assembly
Data Source
Figure 1~2
Figure 3
AI summary
Lighting device (1) intended to be fixed to a wall (3) comprising: a base plate (7) having a rear surface (23) facing the wall (3) and a front surface (21) opposite the rear surface (23), a lighting assembly (9) comprising at least one light source (17) and a control arrangement (14) for the light source (17), the control arrangement (14) comprising a portion of a printed circuit board (15); lighting device (1) in which a portion (19) of the base plate constitutes the substrate (18) for the printed circuit board (15) on which conductive tracks of the substrate (18) are provided.