LED Package Wall Layer Screen Printing for Airtight Sealing
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Solution Overview
Problem
Conventional LED package manufacturing methods involve multiple molding processes, leading to cutter wear, high costs, and issues with cutting burrs that cause moisture invasion and poor adhesion between the fluorescent colloid layer and white silicone wall, resulting in a low-yield product with poor airtight properties.
Innovation Solution
A method where a highly reflective wall layer is formed on a substrate using a screen printing process, reducing the number of cutting steps and eliminating cutter wear, and enhancing adhesion by avoiding direct cutting between the transparent colloid layer and the wall layer, thus preventing moisture invasion and improving product reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If multiple molding processes are used to form the white silicone wall, then the reflectivity is improved, but the device complexity and manufacturing cost increase
Solution Approach 1:
The patent combines the formation of the white silicone wall and the reflective structure into a single molding process. The mold includes a reflective member that forms an integrated reflective structure with the white silicone wall during one injection molding operation, eliminating the need for separate molding processes while maintaining high reflectivity
Solution Approach 2:
The mold structure serves multiple functions simultaneously: it forms the white silicone wall, creates the reflective structure, and defines the groove geometry all in one process. The reflective member integrated into the mold performs both as a forming tool and as part of the final reflective structure
2Shape
If cutting processes are used to form grooves, then the shape precision is improved, but the manufacturing precision deteriorates due to cutting burrs
Solution Approach 1:
The groove shape is pre-formed during the injection molding process itself, before any cutting operations. The mold includes a reflective member that creates the groove geometry as part of the wall structure during molding, eliminating the need for subsequent cutting processes that would generate burrs
Solution Approach 2:
The patent extracts the groove formation step from the cutting process and integrates it into the molding process. By forming the groove shape during injection molding, the harmful cutting burrs are eliminated while maintaining the required groove geometry
3Productivity
If cutting processes are used to separate LED packages, then the productivity is improved, but the reliability deteriorates due to moisture invasion
Solution Approach 1:
The groove structure is pre-formed during the injection molding process, creating the separation geometry before cutting. This preliminary formation of the groove shape allows for cleaner cutting with reduced burrs, thereby maintaining airtightness while enabling efficient separation of multiple LED packages
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a reliable LED package with superior airtight properties and enhanced light output by reducing cutter wear and adhesion issues, while maintaining high reflectivity and preventing moisture invasion.
Implementation Method 1
Since a wall layer is formed on a substrate by virtue of a screen printing process in the present invention
Implementation Method 2
to increase the reflectivity of a light emitting diode (LED) die
Data Source
AI summary
A method of manufacturing LED packages includes the steps of: forming a conductive circuit layer on a substrate; screen printing a wall layer on the conductive circuit layer to form a trellis with a plurality of wall units, so that regions of the conductive circuit layer surrounded by the wall units are exposed; mounting and electrically connecting at least one LED die on the conductive circuit layer within each of the wall units; molding a transparent layer to cover the LED dies; and cutting along the wall units to form a plurality of LED packages.