LED Package Wavelength Conversion Layer Grouping
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Solution Overview
Problem
The manufacturing of LED packages faces challenges in reducing costs and shortening production time, particularly due to variations in color characteristics among light emitting devices, which require individual wavelength conversion layers, increasing complexity and time.
Innovation Solution
A method involving the measurement of color characteristics of light emitted from semiconductor layers, determining the type and amount of wavelength conversion material needed, and forming a wavelength conversion layer to cover groups of light emitting devices with similar characteristics, reducing the need for multiple layers and simplifying the packaging process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If individual wavelength conversion layers are formed for each light emitting device to compensate for color variations, then color characteristics are improved, but manufacturing time and process complexity increase
Solution Approach 1:
The patent merges the wavelength conversion process with the encapsulation process by forming the wavelength conversion layer within the encapsulating resin material. This combines two separate manufacturing steps into one, eliminating the need for individual wavelength conversion layer formation for each LED while still achieving color compensation through selective mixing of wavelength conversion materials during encapsulation.
Solution Approach 2:
The encapsulating resin serves multiple functions: it provides mechanical protection, electrical insulation, and wavelength conversion for color compensation. By incorporating wavelength conversion materials into the encapsulating resin, the same material performs both structural and optical functions, reducing overall process complexity and manufacturing time.
2Manufacturing precision
If individual wavelength conversion layers are formed for each light emitting device, then color characteristics are improved, but device complexity and process steps increase
Solution Approach 1:
The patent merges the wavelength conversion process with the encapsulation process by forming the wavelength conversion layer within the encapsulating resin material. This combines two separate manufacturing steps into one, eliminating the need for individual wavelength conversion layer formation for each LED while still achieving color compensation through selective mixing of wavelength conversion materials during encapsulation.
Solution Approach 2:
The encapsulating resin serves multiple functions: it provides mechanical protection, electrical insulation, and wavelength conversion for color compensation. By incorporating wavelength conversion materials into the encapsulating resin, the same material performs both structural and optical functions, reducing overall process complexity and manufacturing time.
3Ease of manufacture
If wavelength conversion material is uniformly distributed, then manufacturing is simplified, but color compensation precision for individual devices decreases
Solution Approach 1:
The patent applies local quality by selectively mixing wavelength conversion materials in different proportions within the encapsulating resin based on the specific color characteristics of each LED device. This allows each device to receive customized wavelength conversion material distribution while still using a unified encapsulation process, achieving both manufacturing simplicity and color compensation precision.
Solution Approach 2:
The patent changes the concentration and composition parameters of wavelength conversion materials in the encapsulating resin to match the specific color characteristics of each LED device. By adjusting these material parameters locally for each device while maintaining a unified manufacturing process, the patent achieves precise color compensation without increasing process complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing time and costs by standardizing wavelength conversion layers across similar light emitting devices, enhancing efficiency and minimizing product defects.
Implementation Method 1
A type and an amount of wavelength conversion material for color compensating each of the plurality of light emitting devices is determined based on a difference between the measured color characteristics and target color characteristics
Data Source
AI summary
A method of manufacturing a light emitting device package includes forming a plurality of light emitting devices by growing a plurality of semiconductor layers on a wafer, and measuring color characteristics of light emitted from each of the plurality of light emitting devices. For each of the plurality of light emitting devices, a type and an amount of wavelength conversion material is determined for color compensating the light emitting device based on a difference between the measured color characteristics and target color characteristics. A wavelength conversion layer is formed on at least two light emitting devices among the plurality of light emitting devices, the wavelength conversion layer having the type and the amount of wavelength conversion material determined for the at least two light emitting devices. The plurality of light emitting devices is then divided into individual light emitting device packages.