LED Wavelength Conversion Layer Resin Barrier Design
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Solution Overview
Problem
In light-emitting devices with compound semiconductor diodes, the loose structure of conductive units formed by evaporation leads to shrinkage during eutectic bonding, causing the phosphor layer to flow into gaps and disrupting the bonding process, resulting in inefficient light conversion and potential failure of eutectic bonding.
Innovation Solution
A light-emitting device design featuring a semiconductor stack with a wavelength conversion layer that does not physically contact the base, incorporating a resist layer and a trench structure to prevent phosphor layer flow, and optionally using a transparent glue layer to enhance process stability and prevent phosphor particle fallout, while allowing the wavelength conversion layer to cover only the upper surface of the light-emitting units.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the conductive units are formed by evaporation to connect the light-emitting diode and substrate, then the connection is established, but the loose structure causes shrinkage during eutectic bonding which leads to phosphor layer flow and bonding failure
Solution Approach 1:
A resin layer is introduced as an intermediary substance between the phosphor layer and the conductive units/substrate. This resin layer prevents direct contact and eliminates the harmful interaction where phosphor flows into gaps during bonding. The resin serves as a barrier that maintains structural integrity while allowing the bonding process to proceed reliably.
Solution Approach 2:
The patent applies preliminary protective action by coating the conductive units with a reflective material before the bonding process. This preliminary step prevents phosphor from adhering to the conductive units during eutectic bonding, thereby preventing the harmful flow and ensuring bonding success.
2Use of energy by moving object
If the phosphor layer is applied to cover the light-emitting diode, then light conversion is enabled, but the phosphor flows into gaps during eutectic bonding causing bonding failure
Solution Approach 1:
The resin layer acts as a mediator that allows the phosphor layer to maintain its light conversion function while preventing the harmful flow into gaps. The intermediary layer enables both functions to coexist without interference.
Solution Approach 2:
The reflective coating on conductive units provides beforehand protection against phosphor flow. This preliminary protective measure cushions against the potential harm of phosphor intrusion during the bonding process, ensuring both light conversion and bonding reliability.
3Ease of manufacture
If the conductive unit structure is loose to allow connection formation, then connection is achieved, but shrinkage occurs during eutectic bonding creating gaps
Solution Approach 1:
The resin layer serves as a compensating intermediary that fills and stabilizes the gap between the conductive unit and substrate during bonding. This mediator maintains manufacturing precision despite the loose structure needed for easy connection formation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents the flow of the wavelength conversion layer into gaps between electrodes and the base, ensuring stable bonding and improved light conversion efficiency, particularly by allowing more light to be converted through the use of protrusion parts and transparent glue layers, which also enhance manufacturing stability.
Implementation Method 1
white light can be obtained by a combination of the blue light-emitting diode and phosphors
Implementation Method 2
the wavelength conversion layer does not physically contact the base
Data Source
AI summary
A light-emitting device comprises a base, a light-emitting unit comprising a semiconductor stack disposed on the base, and a wavelength conversion layer covering the light-emitting unit, wherein the wavelength conversion layer does not physically contact the base.