LED Package Wavelength Conversion for Continuous Light Distribution
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Solution Overview
Problem
Conventional vehicle headlights using LED chips experience discontinuous light distribution due to rectangular cutoffs caused by spaces between LED chips, leading to suboptimal light emission.
Innovation Solution
A light emitting device package with linearly arranged LED chips and wavelength conversion units, such as phosphor films, that extend over the spaces between the chips, ensuring continuous light emission by converting wavelengths and reducing dark areas between the chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If a plurality of LED chips are arranged linearly to increase luminance, then light output quantity is improved, but discontinuous light distribution with rectangular cutoff occurs due to spaces between chips
Solution Approach 1:
A wavelength conversion unit is introduced as an intermediary element between adjacent LED chips. This unit extends into the spaces between chips and converts a portion of the emitted light to different wavelengths, effectively filling the dark regions and creating continuous light distribution while preserving the high luminance output of multiple chips
Solution Approach 2:
The wavelength conversion unit is strategically positioned to extend into specific regions between LED chips where dark portions occur. By applying wavelength conversion only in these critical gap regions, the patent locally improves light distribution continuity without affecting the overall high power output of the LED array
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances light distribution characteristics by ensuring continuous light emission, increasing light intensity between LED chips, and reducing dark portions, thereby improving the overall light output of vehicle headlights.
Implementation Method 1
a plurality of wavelength conversion units on upper surfaces of the plurality of light emitting device chips, the plurality of wavelength conversion units each having portions that extend over regions between the plurality of light emitting device chips
Data Source
AI summary
A light emitting device package according to example embodiments includes a plurality of light emitting device chips arranged linearly and spaced apart from each other on a substrate, and a plurality of wavelength conversion units on upper surfaces of the plurality of light emitting device chips. The plurality of wavelength conversion units may each have portions that extend over regions between the plurality of light emitting device chips. A vehicle headlight may include the light emitting device package.