LED Wavelength-Converting Layer Dimensionality Change
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Solution Overview
Problem
Existing light emitting diode (LED) systems with wavelength-converting layers face issues of color variation and irregular light distribution due to misalignment or improper sizing of the wavelength-converting sheet, leading to partial emission without wavelength conversion, resulting in blue rings or uneven white light emission.
Innovation Solution
A wavelength-converting layer with a width greater than the LED chip's surface, featuring an adhesive layer that spreads uniformly over the chip, ensuring complete light coverage and conversion, including a second surface that extends beyond the first surface to accommodate maximum light emission width and a third surface with a predetermined angle to maintain stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the wavelength-converting sheet area is smaller than the LED chip upper surface area, then the wavelength-converting sheet can be properly attached, but light is partially emitted without wavelength conversion causing irregular white light distribution and blue ring formation
Solution Approach 1:
The wavelength-converting layer is extended from a two-dimensional sheet on the upper surface to a three-dimensional structure that includes side surfaces. The layer has a first width on the upper surface and a second width on the side surface, with the second width being greater than the first width, ensuring complete coverage of light emission paths from multiple dimensions.
Solution Approach 2:
The wavelength-converting layer is divided into multiple functional surfaces: an upper surface for attachment to the LED chip, side surfaces extending downward to cover lateral light emission, and a lower surface positioned near the light emission source. This segmentation allows each surface to address specific light conversion needs.
2Stability of the object's composition
If the wavelength-converting sheet area is greater than the LED chip upper surface area, then complete light coverage is achieved, but the sheet moves in a predetermined direction due to adhesive fluidity
Solution Approach 1:
The adhesive layer is applied locally only to the upper surface of the wavelength-converting layer where it contacts the LED chip, rather than covering the entire extended structure. This localized adhesion provides sufficient attachment while minimizing the adhesive volume that could cause fluidity-induced movement.
Solution Approach 2:
The wavelength-converting layer is pre-formed with its extended side surfaces and specific width configuration before attachment to the LED chip. This preliminary structuring ensures proper positioning and light coverage while reducing the need for excessive adhesive that could cause movement during assembly.
3Ease of manufacture
If a conventional wavelength-converting sheet is used with area matching the LED chip upper surface, then attachment is simplified, but color variation occurs between vertical surface and side emission
Solution Approach 1:
The wavelength-converting layer extends from the upper surface into the vertical dimension along the side surfaces of the LED chip. This three-dimensional configuration ensures that light emitted from both the upper surface and side surfaces passes through the wavelength-converting material, achieving color consistency across all emission directions.
Solution Approach 2:
The wavelength-converting layer has different width dimensions at different locations: a first width on the upper surface for simple attachment and a greater second width on the side surfaces for complete light conversion coverage. This local variation in dimensions addresses both manufacturing simplicity and color consistency requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures uniform white light emission by converting both upper and side-emitted light, preventing blue rings and color variations, and maintaining the stability of the wavelength-converting layer through proper adhesion and design.
Implementation Method 1
a wavelength-converting layer arranged on an upper surface of a light emitting diode (LED) chip. The wavelength-converting layer may convert a wavelength of light emitted from the LED chip
Data Source
AI summary
The present invention provides a light emitting element, which includes a light emitting diode (LED) chip and a wavelength-converting layer arranged on a surface of the LED chip, the wavelength-converting layer to convert a wavelength of light emitted from the LED chip, wherein at least a portion of the wavelength-converting layer has a width greater than the width of the surface of the LED chip.