Mount-Free LED Packaging via Wavelength Converting Layer
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Solution Overview
Problem
Conventional semiconductor light emitting devices require attachment to a mount, which can be inconvenient in applications with incompatible platforms or those needing multiple LEDs with individual optical elements in close proximity.
Innovation Solution
A packaged semiconductor light emitting device configuration where LEDs are mechanically connected only through a wavelength converting layer, which absorbs and emits light of a different wavelength, eliminating the need for a mount and allowing for improved thermal conductivity and optical element formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If LED is attached to a mount, then mechanical support and thermal management are provided, but device complexity increases and adaptability to different platforms decreases
Solution Approach 1:
The patent extracts and removes the mount from the LED device structure. The LED chip is directly mounted on the circuit board without an intermediate mount structure, eliminating the need for separate mechanical support and thermal management components. This reduces device complexity and improves adaptability to different platforms.
Solution Approach 2:
The patent merges the functions of mechanical support and thermal management directly into the circuit board through the solder bump connection. The circuit board simultaneously provides electrical connection, mechanical support, and heat dissipation pathways, eliminating the need for a separate mount structure.
2Illumination intensity
If multiple LEDs with individual optical elements are placed in close proximity, then optical performance is improved, but manufacturing complexity increases
Solution Approach 1:
The patent applies preliminary action by forming the wavelength converting layer over multiple LED chips before they are fully assembled and tested. This allows for precise control of the wavelength converting material distribution and thickness, ensuring consistent optical performance while simplifying subsequent assembly processes.
Solution Approach 2:
The wavelength converting layer serves multiple functions simultaneously: it converts the wavelength of light from multiple different LED chips, provides mechanical support for the optical elements, and maintains precise spacing between adjacent LEDs. This multi-functionality reduces manufacturing complexity while preserving optical performance.
3Power
If LED is designed for high power density, then efficiency is improved, but thermal management becomes more difficult
Solution Approach 1:
The patent introduces thermal interface material as an intermediary between the LED chip and the circuit board. This material optimizes thermal transfer from the high-power LED chip to the heat dissipation pathways in the circuit board, enabling efficient thermal management while maintaining high power density operation.
Solution Approach 2:
The patent transitions from two-dimensional heat dissipation (through the mount) to three-dimensional heat dissipation by utilizing vertical thermal pathways through the circuit board substrate and lateral heat spreading within the board plane. This multi-directional heat dissipation approach effectively manages thermal loads from high-power LEDs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the creation of mount-free LED devices with enhanced thermal conductivity and flexibility in application, suitable for various platforms and high power densities, while maintaining efficient light emission and optical performance.
Implementation Method 1
A wavelength converting layer is disposed in a path of light emitted by the plurality of light emitting devices. The wavelength converting layer absorbs light emitted by the light emitting device and emits light having a second peak wavelength.
Data Source
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AI summary
Embodiments of the invention include a plurality of light emitting devices (1), one of the light emitting devices in the plurality being configured to emit light having a first peak wavelength. A wavelength converting layer (30) is disposed in a path of light emitted by the plurality of light emitting devices. The wavelength converting layer (30) absorbs light emitted by the light emitting device and emits light having a second peak wavelength. The light emitting devices (1) are mechanically connected to each other only through the wavelength converting layer (30). In other embodiments a light converting layer is placed over the light emitting devices and an adhesive or optical element layer is placed at the side surfaces and over the light converting layer, the light emitting devices are mechanically connected to each other only through the wavelength converting layer.