LED Package Wire Bond Structure for Stitch Breakage Resistance
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Solution Overview
Problem
Conventional LED technologies face issues with wire bond strength being compromised and stitches breaking due to external forces during handling, leading to reduced or failed performance.
Innovation Solution
An enhanced wire bond configuration with a second bump on top of the wire stitch and a soft encapsulant material with a defined Shore hardness less than Shore A70, which absorbs external forces and prevents wire damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a wire is ball bonded from a lead frame and stitched directly on top of a bump bonded to the LED chip, then the electrical connection is established, but the wire bond strength is compromised and the stitch can break under external force
Solution Approach 1:
The patent divides the wire bonding structure into multiple segments: a first bump bonded to the LED chip, a wire stitch formed on the first bump, and a second bump bonded on top of the wire stitch. This segmentation distributes the mechanical stress across multiple bonding points rather than concentrating it at a single stitch location, thereby preventing stitch breakage under external force while maintaining reliable electrical connection.
2Ease of manufacture
If conventional wire bonding is used without additional protective structures, then the manufacturing process is simple, but the wire bond strength is compromised during handling operations
Solution Approach 1:
The patent applies preliminary action by bonding the second bump on top of the wire stitch before the LED package undergoes handling operations. This pre-established protective structure anticipates and prevents potential damage during subsequent manufacturing and handling processes, ensuring wire bond strength is maintained without complicating the overall manufacturing flow.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The configuration enhances wire bond strength and prevents breakage during handling, maintaining electrical contact and improving LED performance.
Implementation Method 1
a soft encapsulant material with a defined Shore hardness less than Shore A70, which absorbs external forces and prevents wire damage
Data Source
AI summary
An enhanced wire bond configuration for a light emitting diode (LED) package is presented herein. An optoelectronic component comprises a surface mountable package, the surface mountable package comprising: an LED chip that has been bonded, within a cavity of the surface mountable package, to a lead frame of the surface mountable package; a first bump that has been bonded onto a bond pad of the LED chip; a wire that has been ball bonded onto the lead frame; a wire stitch of the wire that has been formed on top of the first bump; and a second bump that has been bonded on top of the wire stitch. An encapsulant material including a defined softness can cover the LED chip, and can be added, injected, transfer-molded, and/or filled into the cavity. The defined softness can include a Shore hardness that is less than Shore 70A.