LED Module Wire-Grid Polarization for Low-Crosstalk 3D Displays
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Solution Overview
Problem
Existing polarized 3D display technologies face issues such as light leakage, phase differences, and light interference due to inaccuracies in attaching polarized 3D films to LED lamp beads, affecting the 3D viewing effect.
Innovation Solution
An LED module manufacturing method involving the formation of metal wire grids with grid wires extending in different directions on LED lamp beads, eliminating the need for precise alignment and attachment of polarizing films, thereby preventing light intrusion and optical crosstalk.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If polarized 3D films are attached to LED lamp beads, then 3D viewing effect is achieved, but light leakage and crosstalk occur due to alignment errors
Solution Approach 1:
The patent extracts the polarizing function from the external polarized 3D film and integrates it directly into the LED lamp bead structure by forming metal wire grids on the LED chip surface. This eliminates the separate film attachment step and its associated alignment errors, while maintaining the 3D viewing effect through the integrated wire grid polarizer.
Solution Approach 2:
The patent merges the polarizing function with the LED lamp bead structure by forming metal wire grids directly on the LED chip surface during the manufacturing process. This integration combines the light emission function and polarization function into a single unified structure, eliminating the need for separate film attachment and improving alignment precision.
2Ease of manufacture
If polarized 3D films are attached to LED lamp beads, then 3D display is enabled, but light interference and crosstalk increase
Solution Approach 1:
The patent removes the external polarized film that causes light interference and crosstalk, and instead extracts the polarizing function to be implemented through metal wire grids formed directly on the LED chip. This eliminates the interface between film and LED that causes light leakage and interference.
Solution Approach 2:
The metal wire grid acts as an intermediary structure that polarizes the light emitted by the LED chip without requiring external films. The wire grid structure provides controlled light polarization while preventing the light interference and crosstalk issues associated with film-based solutions.
3Manufacturing precision
If metal wire grids are formed on LED lamp beads, then precise alignment is achieved, but manufacturing complexity increases
Solution Approach 1:
The patent performs preliminary action by forming the metal wire grid pattern on the LED chip surface during the LED manufacturing process itself, before the LED is assembled into the final product. This preliminary formation of the polarizing structure ensures precise alignment with the LED chip geometry and eliminates subsequent alignment steps.
Solution Approach 2:
The patent replaces the mechanical film attachment process with a deposition process that forms metal wire grids directly on the LED chip surface. This substitution of the manufacturing method achieves precise alignment through material deposition rather than mechanical positioning, simplifying the overall manufacturing system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method produces a 3D viewing effect by polarizing light emitted from LED lamp beads without the need for polarizing films, ensuring precise alignment and reducing light interference and crosstalk, suitable for small-pitch LED displays and various 3D display types.
Implementation Method 1
preparing a metal wire grid, which has grid wires extending in a same direction, by the metal thin film layer... polarizing light emitted from LED lamp beads
Data Source
AI summary
The present disclosure provides an LED module manufacturing method and an LED module. The LED module manufacturing method includes: selecting a lamp bead substrate and connecting a plurality of groups of LED chips to the lamp bead substrate; forming an encapsulation adhesive layer on the lamp bead substrate by an encapsulation adhesive to encapsulate the plurality of groups of LED chips; preparing a metal thin film layer on the encapsulation adhesive layer and preparing a metal wire grid, which has grid wires extending in the same direction, by the metal thin film layer; cutting the lamp bead substrate based on each group of LED chips; repeatedly performing the above steps; arranging the at least two types of LED lamp beads, which have metal wire grids with grid wires extending in different directions, in an array on a module substrate to obtain an LED module.