Wire Loop Flexure for LED Thermal Shock Resistance
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Solution Overview
Problem
Existing methods for manufacturing light-emitting devices with wire loop shapes, including flexures, are complex and prone to wire breakage due to expansion and contraction of encapsulating materials, which affects the device's reliability and durability.
Innovation Solution
A method involving a capillary process to form a wire loop shape with a flexure by transferring the capillary through specific points to create a ball, neck, bent, and flexure portions, connecting the wire to both the light-emitting element and substrate, and encapsulating the wire with a resin material to prevent breakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a wire loop shape with flexure is formed using conventional capillary methods, then the wire can connect bonding points, but the process is complex and prone to wire breakage during encapsulation
Solution Approach 1:
The patent performs preliminary actions by forming the wire loop shape with flexure before encapsulation, and by pre-positioning the capillary at specific points (+Z above first bonding point, -X from first point, +X beyond second bonding point) to ensure proper wire configuration is established in advance, preventing wire breakage during subsequent encapsulation processes
Solution Approach 2:
The capillary serves as an intermediary tool that enables precise control of wire positioning and loop formation. The method uses the capillary to mediate the wire shaping process, transferring it through specific spatial points to create the desired loop configuration with flexure that accommodates encapsulation stresses
2Reliability
If the wire is rigidly connected between bonding points, then electrical connection is established, but the wire is susceptible to breakage from encapsulating material expansion and contraction
Solution Approach 1:
The patent applies beforehand cushioning by incorporating a flexure portion into the wire loop shape before encapsulation. This pre-formed flexure acts as a cushioning element that absorbs and accommodates the expansion and contraction stresses from the encapsulating material, preventing wire breakage while maintaining electrical connectivity
Solution Approach 2:
The wire is designed with a flexible loop configuration including a neck portion and bent portion that can deform elastically. This flexible structure allows the wire to accommodate thermal and mechanical stresses from encapsulation without rigid failure, maintaining both electrical function and mechanical integrity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method allows for the easy formation of light-emitting devices with wire loop shapes that include flexures, enhancing thermal-shock resistance and preventing wire breakage, thereby improving the device's reliability and durability.
Implementation Method 1
forming an initial ball on a wire inserted into a capillary
Implementation Method 2
forming an initial ball on a wire inserted into a capillary
Implementation Method 3
forming an encapsulating member to encapsulate the wire
Data Source
AI summary
A method for manufacturing a light-emitting device includes: a first connecting step of forming a ball portion of the wire joined to a first connecting point on a light emitting element; a first transferring step of transferring the capillary to a first point located in a +Z direction above the first connecting point; a second transferring step of transferring the capillary from the first point to a second point located in a −X direction opposite from a second connecting point on the substrate; a third transferring step of transferring the capillary from the second point to a third point located in a +X direction beyond the second connecting point and in the +Z direction above the second connecting point; a second connecting step of transferring the capillary and joining the wire to the second connecting point; and forming an encapsulating member to encapsulate the wire.