Light Emitting Device Wire Resin Indentation Testing
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Solution Overview
Problem
Existing light emitting devices face inefficiencies in electrical continuity testing and light emission testing due to the complexity of connecting test terminals to separated electrode leads, which can also cause stress to the light emitting element and sealing member during separation and bending.
Innovation Solution
Incorporating a wire covered with a resin molded body that extends from the electrode leads to an indentation on the element container, allowing for electrical connection to the lead frame, simplifying testing and reducing stress by facilitating easier detachment and reducing interference with the resin molded body.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electrode leads are separated and bent for connection to lead frame, then electrical connection is achieved, but testing efficiency decreases and stress is applied to light emitting element and sealing member
Solution Approach 1:
The wire is preliminarily positioned and covered with resin molded body before final assembly, creating pre-formed test access paths. The indentation is prepared in advance on the resin molded body surface, allowing test terminals to be easily connected without subsequent separation or bending operations on electrode leads.
2Reliability
If electrode leads are separated and bent for connection to lead frame, then electrical connection is achieved, but stress is applied to light emitting element and sealing member
Solution Approach 1:
The wire is extracted as a separate conductive element that carries electrical connection functions away from the electrode leads. This allows electrode leads to remain in their original positions without separation or bending, eliminating stress on the light emitting element and sealing member while maintaining electrical connectivity through the wire.
3Productivity
If wire is covered with resin molded body and extends to indentation, then testing efficiency improves, but device complexity increases
Solution Approach 1:
The wire, resin molded body, and indentation are merged into an integrated structure. The resin molded body simultaneously serves as insulation, structural support, and creates the indentation feature for test terminal access. This integration simplifies the overall device by combining multiple functions into a single cohesive component rather than separate elements.
Data Source
AI summary
A light emitting device includes an element container and a light emitting element. The element container has a first electrode lead, a second electrode lead, and a resin molded body integrated with the first electrode lead and the second electrode lead and includes an indentation at an outer surface, a wire covered with the resin molded body and extending from the first electrode lead to the indentation. The light emitting element is housed in the element container and electrically connected to the first electrode lead and the second electrode lead.