LED Wiring Layout With Insulating Openings for Lower Forward Voltage
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Solution Overview
Problem
Conventional light-emitting elements have high forward voltages, which hinder efficient operation and energy consumption.
Innovation Solution
The light-emitting element design includes a substrate with conductive members, insulating layers, and wirings that are strategically connected through openings in the insulating layers to reduce sheet resistance and improve heat dissipation, thereby reducing the forward voltage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If conventional wiring structure is used, then device complexity is reduced, but forward voltage is high
Solution Approach 1:
The patent segments the wiring structure by introducing multiple separate wirings (first wiring, second wiring, third wiring) instead of a single conventional wiring. Each wiring is strategically positioned and connected to different components (conductive member, first light-emitting unit, second light-emitting unit) to optimize electrical pathways and reduce overall forward voltage.
Solution Approach 2:
The patent utilizes the vertical dimension by forming wirings at different heights and positions relative to the substrate. The first wiring is electrically connected to the conductive member through openings in the insulating layer, while the second and third wirings are positioned at different locations to connect to respective light-emitting units, creating a three-dimensional wiring architecture that reduces forward voltage.
2Temperature
If insulating layer is made thicker, then insulation performance is improved, but heat dissipation is reduced
Solution Approach 1:
The patent applies local quality by creating openings in the insulating layer at specific locations where electrical connection and heat dissipation are needed. The insulating layer maintains its thickness and insulation performance in most areas, while localized openings are provided to allow the first wiring to contact the conductive member, enabling heat dissipation pathways without compromising overall insulation.
Solution Approach 2:
The insulating layer is designed with a porous structure containing openings that penetrate through it. These openings serve dual purposes: allowing electrical connection between the first wiring and conductive member, and providing channels for heat dissipation from the underlying components while maintaining the insulating properties of the material itself.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively lowers the forward voltage and enhances heat dissipation, improving the efficiency and performance of the light-emitting element.
Implementation Method 1
the first wiring is in contact with the conductive member through the one or more first openings
Implementation Method 2
improve heat dissipation, thereby reducing the forward voltage
Data Source
AI summary
A light-emitting element includes: a substrate; a conductive member disposed on the substrate; a first insulating layer disposed on the conductive member; a semiconductor structure including a first light-emitting unit and a second light-emitting unit that are spaced apart from each other on the first insulating layer; a first wiring electrically connected to a first semiconductor layer of the first light-emitting unit; a second wiring electrically connected to a second semiconductor layer of the first light-emitting unit and the first semiconductor layer of the second light-emitting unit; a third wiring electrically connected to the second semiconductor layer of the second light-emitting unit; a first pad electrode separated from the semiconductor structure in a plan view and electrically connected to the first wiring; and a second pad electrode separated from the semiconductor structure in a plan view and electrically connected to the third wiring.