Reflective Frame Insulating Film for LED Wiring Reliability
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Solution Overview
Problem
Semiconductor devices face performance degradation due to insulation deterioration between bonding wires and semiconductor elements, particularly in light emitting devices where separate control of blue and red LED elements requires additional external electrodes and complex wiring, leading to increased risk of insulation failure and optical output degradation.
Innovation Solution
A semiconductor device design featuring a substrate with first and second semiconductor elements, external electrodes, and a reflective frame around the mount area, where bonding wires bridge across the frame to ensure insulation between the elements and external electrodes, reducing the risk of insulation deterioration and enhancing light extraction efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bonding wires are used to connect semiconductor elements to external electrodes, then electrical connection is achieved, but insulation deterioration occurs due to close spacing and contact between bonding wires
Solution Approach 1:
The patent introduces a Z-direction (vertical dimension) by forming an insulating film between bonding wires that connect to different potential electrodes. This vertical insulation layer prevents contact and insulation deterioration without requiring increased horizontal spacing, thus resolving the contradiction between reliability and device complexity.
Solution Approach 2:
An insulating film is introduced as an intermediary element between bonding wires that connect to electrodes of different potentials. This insulating film acts as a mediator that prevents direct contact between bonding wires, ensuring insulation while maintaining the original wiring arrangement and avoiding increased device complexity.
2Adaptability or versatility
If additional external electrodes are added for separate control of blue and red LED elements, then separate control capability is achieved, but insulation deterioration risk increases due to increased bonding wire contact
Solution Approach 1:
The patent applies vertical insulation through insulating films formed in the Z-direction between bonding wires connected to separately controlled LED elements. This allows additional external electrodes for separate control while preventing insulation deterioration through the vertical barrier, resolving the contradiction between adaptability and reliability.
3Ease of manufacture
If light-absorbing material is used for external wirings, then wiring functionality is achieved, but optical output is degraded
Solution Approach 1:
The patent applies local quality by making the insulating film transparent or translucent in the regions where bonding wires are present, while maintaining the wiring functionality. This localized adjustment allows the wiring to perform its electrical function while minimizing light absorption, thus resolving the contradiction between ease of manufacture and optical output.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents performance degradation by ensuring electric insulation of bonding wires and improves light extraction efficiency by reflecting emitted light back into the mount area, simplifying the wiring arrangement and reducing the risk of insulation failure.
Implementation Method 1
a frame of reflective material formed at a periphery of the mount area
Data Source
AI summary
The present invention relates to a semiconductor device, including: a substrate; a plurality of first semiconductor elements and a second semiconductor element arranged on a mount area of the substrate; an external electrode to supply electricity to the first and second semiconductor elements; and a frame of reflective material formed at a periphery of the mount area. Extensions of the first external electrodes are formed at the inner side of the plurality of wirings, and the first external electrodes are formed along the periphery of the mount area at the outer side of at least one of the second external electrodes or the wiring connected to the second external electrodes, and electrodes of the plurality of first semiconductor elements are electrically connected to the pair of first external electrodes by a bonding wire that bridges across at least one of the pair of the second external electrodes or the wiring electrically connected to the pair of second external electrodes with intervening a part of the frame therebetween.