LED Display Wiring Layout With Light Shielding and Chip Alignment
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Solution Overview
Problem
Existing LED displays face issues with light reflection from metal wiring, reducing image visibility and contrast, and also suffer from decreased manufacturing tact due to positional accuracy challenges in mounting LED chips on circuit substrates.
Innovation Solution
The proposed display device incorporates a light-shielding layer with liquid repellency to prevent light reflection from metal wiring and improves manufacturing efficiency by accurately positioning LED chips using a solvent-based alignment method.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If metal wiring is used to connect LED chips and pixel circuits, then electrical connectivity is achieved, but light reflection occurs that reduces image visibility and contrast
Solution Approach 1:
The patent introduces a light-shielding layer as an intermediary substance between the metal wiring and the display surface. This layer blocks light from reflecting off the metal wiring while still allowing electrical connectivity to function, thus resolving the contradiction between ease of manufacture and harmful light reflection.
Solution Approach 2:
The patent converts the harmful light reflection from metal wiring into a beneficial effect by using the same metal layer to provide both electrical connectivity and light shielding. The metal wiring serves dual purposes: conducting electricity and blocking light when positioned appropriately, thus turning a harmful factor into a benefit.
2Device complexity
If conventional mounting methods are used to attach LED chips to circuit substrates, then manufacturing process is simple, but positional accuracy deteriorates due to alignment challenges
Solution Approach 1:
The patent replaces conventional mechanical alignment and mounting methods with a solvent-based chemical bonding system. The solvent penetrates through openings in the light-shielding layer to adhesive layers, chemically bonding LED chips to the circuit substrate with high precision without requiring complex mechanical alignment systems.
Solution Approach 2:
The patent uses solvent and adhesive layers as intermediary substances between the LED chips and the circuit substrate. These intermediaries enable precise positioning and secure bonding while simplifying the overall mounting process, replacing complex mechanical alignment systems with a more straightforward chemical bonding approach.
3Object-affected harmful factors
If light-shielding layer is added to prevent light reflection, then image visibility improves, but device complexity increases
Solution Approach 1:
The patent makes the light-shielding layer multi-functional by using it not only for light reflection suppression but also as a support structure for openings that facilitate solvent-based alignment. The same layer serves multiple purposes: blocking light, providing structural support, and enabling precise positioning of LED chips, thus reducing overall device complexity despite adding functional layers.
Solution Approach 2:
The patent merges the light-shielding function with the alignment and bonding function in a single integrated structure. The light-shielding layer is combined with openings and adhesive layers to create a multi-functional component that simultaneously addresses light reflection suppression and precise positioning, reducing the need for separate components and simplifying the overall device structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances image visibility by suppressing light reflection and improves manufacturing tact by ensuring precise alignment of LED chips, thereby improving overall display performance and efficiency.
Implementation Method 1
a first LED chip in contact with the solvent in a first opening of the plurality of openings
Implementation Method 2
adhering the adhesive layer to the first LED chip and the pixel circuit to the adhesive layer by evaporating the solvent
Data Source
AI summary
A display device includes a substrate provided on a driving circuit, an adhesive layer covering the substrate, a first LED chip provided on the adhesive layer, a pixel circuit provided on the adhesive layer, separated from the first LED chip, a light shielding layer provided on the adhesive layer, and a first opening of the same shape as that of the first LED chip when viewed in a plan view and a second opening of the same shape as that of the pixel circuit when viewed in a plan view, an insulating layer covering the driving circuit and the pixel circuit, and a first wiring provided on the insulating layer, connected to the first LED chip and the pixel circuit, wherein the first wiring overlaps the light shielding layer.