Light Emitting Device Wiring for Substrate Joining Strength
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing light emitting devices face challenges in achieving strong joining between the substrate and the cover member, leading to potential delamination issues due to inadequate contact area and positional precision of light emitting elements.
Innovation Solution
A light emitting device design featuring a substrate with specific wiring configurations and a cover member that includes a connection wiring portion with varying widths, allowing for increased contact area and improved positional alignment of light emitting elements, enhancing the joining strength between the substrate and cover member.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the connection wiring portion has a uniform width, then the manufacturing process is simple, but the joining strength between substrate and cover member is insufficient
Solution Approach 1:
The connection wiring portion is designed with non-uniform width, featuring a connection central portion with a first width and connection end portions with a second width greater than the first width. This local variation in width provides enhanced contact area at the ends for improved joining strength with the cover member, while the narrower central portion maintains manufacturing simplicity and reduces material usage.
2Strength
If the contact area between substrate and cover member is increased, then the joining strength is improved, but the device size increases
Solution Approach 1:
The connection wiring portion is segmented into distinct regions: a connection central portion and connection end portions. The end portions have increased width to provide localized contact area enhancement for improved joining strength, while the central portion maintains a narrower profile. This segmentation allows the contact area to be concentrated where needed without proportionally increasing the overall device footprint.
3Area of stationary object
If the width of connection wiring portion varies, then the contact area with cover member is increased, but the manufacturing precision requirements increase
Solution Approach 1:
The width variation in the connection wiring portion is implemented in a controlled and localized manner, with clearly defined transition zones between the narrower central portion and wider end portions. This localized quality change allows for increased contact area at critical regions while maintaining manageable manufacturing precision requirements through standardized design parameters and gradual transitions.
Data Source
AI summary
A light emitting device includes a substrate including first, second, third and fourth wiring portions on a top surface of a base member and arrayed in a first direction, and a connection wiring portion connecting the second and third wiring portions. The connection wiring portion includes first and second connection ends respectively connected with the second and third wiring portions, and a connection central portion connecting the first and second connection ends and having a maximum width in a second direction different from each of a maximum width of the first connection end and a maximum width of the second connection end. In the second direction, at least a part of the connection wiring portion has a width narrower than each of a maximum width of the second wiring portion and a maximum width of the third wiring portion.