LED Semiconductor Part Wiring for Recessed Terminal Testing
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Solution Overview
Problem
Existing methods for manufacturing light emitting devices face challenges in accurately evaluating the electrical properties of semiconductor parts due to the difficulty in contacting small, recessed terminals, which hinders efficient evaluation and selection of functional parts.
Innovation Solution
A method involving the formation of an insulating member to expose terminals, followed by the creation of larger area wirings that connect adjacent semiconductor parts, allowing for easier contact with testing devices and facilitating serial connection and evaluation of electrical properties, with subsequent removal of the insulating member and wirings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If terminals are made small and recessed to reduce device size and improve integration, then device compactness is improved, but difficulty in contacting terminals for testing increases
Solution Approach 1:
The patent introduces a contact structure that acts as an intermediary between the testing device and the recessed terminals. This contact structure includes a contact portion that can be inserted into the recessed terminal region, bridging the gap between the external testing equipment and the hidden terminals, thereby enabling electrical contact without requiring the terminals to be exposed on the surface
Solution Approach 2:
The patent transitions from surface-level terminal contact to three-dimensional contact by creating a contact structure that extends vertically into the recessed region. The contact portion is positioned at different height levels to match the terminal positions, allowing electrical contact in the vertical dimension rather than requiring horizontal surface exposure
2Ease of operation
If terminals are exposed on the surface for easy testing, then ease of operation is improved, but device compactness and integration are worsened
Solution Approach 1:
The patent moves the terminal contact interface from the horizontal surface plane to the vertical dimension by creating recessed terminals at different height levels. This allows terminals to be accessible for testing through vertical insertion of contact structures rather than requiring horizontal surface exposure, maintaining compactness while enabling testing
3Ease of operation
If wiring area is increased to facilitate testing device contact, then ease of operation is improved, but manufacturing precision requirements are worsened
Solution Approach 1:
The patent divides the contact structure into multiple segmented contact portions, each corresponding to a specific terminal. This segmentation allows each contact portion to be independently positioned and aligned with its corresponding terminal, reducing the overall precision requirement compared to a single large wiring structure that would need to accommodate all terminals
Data Source
AI summary
A method of manufacturing a light emitting device comprises: providing a structure body including a substrate and a plurality of semiconductor parts arranged on the substrate, wherein the semiconductor parts individually includes a first semiconductor layer, a second semiconductor layer, a first terminal and a second terminal; disposing an insulating member that covers the semiconductor parts; forming wirings at locations above the semiconductor parts, wherein, the wirings each connect the first terminal and the second terminal of two adjacent semiconductor parts in a direction of arrangement, the wirings serially connect the semiconductor parts, and an area of individual of the wirings is larger than an area of the first terminal or an area of the second terminal in a top view; evaluating electrical properties of the semiconductor parts connected by the wirings by bringing a testing device into contact with the wiring; and removing the insulating member and the wirings.